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5-14: Allwinner chipsets might have security backdoor; Samsung Galaxy X next year would be a foldable 4K smartphone; Sony’s production at the Kumamoto Technology Center will resume operation; etc.

Allwinner system has a backdoor that could influence security of its chipsets; Samsung might have 5 flagships next year, and Galaxy X would be foldable 4K smartphone; Microsoft SparseLightVR could improve immersion experience and solving nausea of VR; Sony’s production at Read more ›

5-13: MediaTek forms strategic collaboration with NavInfo; Apple has announced a USD1 billion investment in Didi Chuxing; Japan Display will build a JPY50 billion production line for OLED panels; etc.

MediaTek forms strategic collaboration with NavInfo; The top-20 semiconductor companies’ sales declined by 6% in 1Q16/1Q15; Samsung Electronics and SK Hynix will both lower their total capex for memory ICs in 2016; Apple has announced a USD1 billion investment in Read more ›

5-12: Sharp reportedly plans to cut 15% of its total workforce in Japan; DRAM chip manufacturers are intending to reduce their inventories in 2Q16; The smartphone market is going to get worse before it gets better; etc.

Sharp reportedly plans to cut 15% of its total workforce in Japan; DRAM chip manufacturers are intending to reduce their inventories in 2Q16; The smartphone market is going to get worse before it gets better; The larger handset of Apple Read more ›

5-8: Indian smartphone shipment reached 24.4mln in 1Q16; HoloFlex holographic flexible smartphone; Doppio “multi-screen” smartwatch; Samsung, Huawei and HTC possibly further pressuring the entire supply chain’s ASPs; etc.

Indian smartphone shipment reached 24.4mln in 1Q16; HoloFlex holographic flexible smartphone; Doppio “multi-screen” smartwatch; Samsung, Huawei and HTC possibly further pressuring the entire supply chain’s ASPs; Google did not give up Android One; etc. Chipset Forbes’ Rober Hof believes that Read more ›

5-6: Qualcomm security flaw impacts Android devices; China Broadcast Network becomes China’s fourth telecom operator; UITC launches 337 investigations (patent infringement) on various electronics companies; etc.

Qualcomm security flaw impacts Android devices; China Broadcast Network becomes China’s fourth telecom operator; UITC launches 337 investigations (patent infringement) on various electronics companies; China-based vendors shipped 128.6 million smartphones globally in 1Q16; Indian government is reportedly still mulling over Read more ›

5-6 Week: This week some headlines – Intel cancels Broxton and SoFIA; SPIL terminates its strategic alliance agreement and share subscription agreement with Tsinghua Unigroup; Samsung will soon be completing development of 3rd-generation LPC (Low-Power Compact) 14nm FinFET; Samsung is expected to release a foldable device next year internally known as “smartlet”; etc.

Weekend is impending, and here summarizing what’s happened in one week:- Some headlines: Intel cancels Broxton (smartphone and tablet) and SoFIA; Taiwan’s SPIL terminates its strategic alliance agreement and share subscription agreement with Tsinghua Unigroup; Samsung will soon be completing Read more ›

5-5: Samsung considers itself a software company more than a hardware manufacturer; Google indicates VR is something the company taking seriously; Micromax Yu wants to redefine flagship with their new phone; etc.

Samsung considers itself a software company more than a hardware manufacturer; Google indicates VR is something the company taking seriously —  wireless, affordable and comfortable; Micromax Yu wants to redefine flagship with their new phone; google to have a hardware Read more ›