8-25 #GreenCode : Apple will be the first customer to use TSMC’s 3nm chips by the end of 2022; Samsung to expand semiconductor production capacity in South Korea; GF plans to raise prices for some of its manufacturing processes by up to 8% in 2023; etc.

Full-scale mass production of the 3nm node is not projected to begin until 2H23, and TSMC will also begin their N3E later in 2023. mportant customers for the 3nm node besides Apple include AMD, Broadcom, Intel, MediaTek, NVIDIA, and Qualcomm. Read more ›

8-20 #CrappyIT : TSMC’s 3nm chip will be mass-produced in 2H22; Samsung aims to invest to increase 4nm production; Samsung has dropped its smartphone shipment to 260M units in 2022; etc.

According to SemiWiki’s Malcolm Penn, the current semiconductor Super Cycle is finally drawing to a close and the 17th market downturn has now well and truly started. At the macro level, the worldwide semiconductor momentum indicator, pictured above, passed through Read more ›

8-13 #Greeniseverything : India has not considered such proposals of restricting Chinese smartphone vendors from selling smartphones below INR12,000; Hyundai Motor Group has announced the launch of Boston Dynamics AI Institute; OPPO is allegedly working on 2 foldable smartphones to be launched internationally; etc.

OPPO is allegedly working on 2 foldable smartphones to be launched internationally. These may be called Find N Fold and Find N Flip, as these names have recently been trademarked with the EU Intellectual Property Office. The upcoming foldable phones Read more ›

8-10 #EveryDayPoked : US President Biden has signed CHIPS; The Indian government is seeking to restrict Chinese vendors from selling sub-INR12,000 smartphones; OPPO and OnePlus have stopped selling products through their German online stores; etc.

United States President Joe Biden has signed into law a bipartisan bill that aims to boost U.S. competitiveness with China. The bill includes more than USD52B for U.S. companies producing semiconductors, as well as billions more in tax credits to Read more ›

8-6 #Technologies : World chip sales growth has decelerated for 6 straight months; Sony expects demand for CIS for high-end smartphones to remain robust this year; Amazon has acquired iRobot; etc.

Apple has reportedly asked suppliers to ensure that shipments from Taiwan to China strictly comply with Chinese customs regulations. Apple has reportedly told suppliers that China has started strictly enforcing a long-standing rule that Taiwanese-made parts and components must be Read more ›

8-5 #Space : Intel and Italy are reportedly close to a USD5B deal to build a chip plant in Italy; The etching machine manufactured by AMEC will be shipped to TSMC’s US factory; CATL has decided to push back announcing a multibillion-dollar North American plant; etc.

Intel will unveil their next-generation Wi-Fi 7 (802.11be) in 2024. Intel is currently developing Intel’s Wi-Fi ‘802.11be’ in order to obtain the ‘Wi-Fi Alliance’ certification, and it will be installed in PC products such as laptops by 2024. Wi-Fi 7 Read more ›

8-3 #Poking : OnePlus will cooperate with TP-LINK; Samsung is developing a new display refresh rate technology; SK hynix has developed its first DDR5 DRAM-based CXL memory samples; etc.

Google is announcing the expansion of partnership with SkyWater Technology. Google is working together to release an open source process design kit (PDK) for SKY90-FD, SkyWater’s commercial 90nm fully depleted silicon on insulator (FDSOI) CMOS process technology. SKY90-FD is based Read more ›