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7-8 #PainPoints : Samsung is developing a new chip package technology; JDI has unveiled a 4K x 4K IPS LCD micro-display; EU requires every portable device to have batteries that are easy to remove and replace by consumers or independent operators by 2027; etc.

Samsung is developing a new chip package technology to prevent overheating in application processors (AP). The package attaches a heat path block, or HPB, on top of the SoC, and is expected to be used on future Exynos chips, sources Read more ›