4-26 #VIPs : vivo has unveiled “BlueImage” brand; Oura is aggressively expanding its retail footprint in the US; Meta has announced that the operating system Horizon OS; etc.

Qualcomm expands the Snapdragon X Series platform portfolio with Snapdragon X Plus. Snapdragon X Plus features the state-of-the-art Qualcomm Oryon CPU, a custom-integrated processor that delivers up to 37% faster CPU performance compared to competitors, while consuming up to 54% Read more ›

4-13 #Gamer : Apple is allegedly focusing on foldable products; OPPO, OnePlus, and realme are reportedly working on the ultrasonic FoD; Huawei is reportedly building a giant R&D center near Shanghai; etc.

Intel and Altera have announced new AI-optimized processors and field programmable gate arrays (FPGAs) for edge computing. By introducing a range of edge-optimized Intel Core Ultra processors, Intel Core processors, and Intel Atom processors, alongside Agilex 5 FPGAs, the companies Read more ›

4-5 #Qingming : TSMC has resumed work at its fabrication sites in Taiwan after an earthquake-led shutdown; Infinix is allegedly developing its first foldable smartphone; Google is allegedly considering charging for AI-powered search; etc.

Taiwan Semiconductor Manufacturing Company (TSMC) has resumed work at its fabrication sites in Taiwan after an earthquake-led shutdown. The company was able to recover quickly, with no damage to critical chipmaking equipment, ensuring minimal disruption to chip supply. Despite initial Read more ›

4-1 #Turbulence : The demand for mature wafer foundry processes is weak; GigaDevice plans to participate in CXMT’s latest capital increase; Micron said that its HBM production capacity in 2024 has already been sold out; etc.

In the era of rapid AI advancements, the need for more computing power has become crucial for future progress. With that, we will witness a drastic increase in transistor counts in semiconductors, potentially reaching the 1T mark by the end Read more ›