7-13 #StarePinch : Google’s Tensor G4 might be the last SoC to be made by Samsung Foundry; Huawei’s triple-foldable smartphone will allegedly adopt a dual-hinge design; Huawei is t adopt under-display 3D face recognition; etc.

Google’s Tensor G4 might be the last SoC that is mass produced by Samsung Foundry, as the Tensor G5 is said to leverage TSMC’s cutting-edge 3nm process when it powers the upcoming Pixel 10 series in late 2025. Since Samsung’s Read more ›

7-8 #PainPoints : Samsung is developing a new chip package technology; JDI has unveiled a 4K x 4K IPS LCD micro-display; EU requires every portable device to have batteries that are easy to remove and replace by consumers or independent operators by 2027; etc.

Samsung is developing a new chip package technology to prevent overheating in application processors (AP). The package attaches a heat path block, or HPB, on top of the SoC, and is expected to be used on future Exynos chips, sources Read more ›

6-30 #Partnership : Samsung is allegedly to adopt MediaTek’s SoC on its S25 series; Apple is exploring a new technology that will make it easier for people to remove the battery; Audi is bringing ChatGPT integration to its Audi models; etc.

According to Chris Patrick, SVP and General Manager of Handsets at Qualcomm, the company has been working on making Android version updates and security updates easier for quite a while. One of the things they been working on for the Read more ›

6-27 #SteamDeck : Huawei is reportedly building a massive semiconductor equipment R&D center in Shanghai; Apple has allegedly renewed efforts to develop AR-only glasses; Honor has showcased some of its latest AI innovations; etc.

Huawei Technologies is reportedly building a massive semiconductor equipment research and development center in Shanghai. The center’s mission includes building lithography machines, vital equipment for producing cutting-edge chips. Total investment for the the entire R&D base will come to about Read more ›

6-18 #WorkTogether : Samsung is to release a next-gen flagship SoC feat its own GPU in 2026; Elon Musk believes smartphone will be replaced by the Neuralink neural interface; Tata Group is allegedly to acquire a majority stake in the Indian unit of vivo; etc.

The National Institute of Advanced Industrial Science and Technology (AIST) in Japan and IBM aim to develop a quantum computer with 10,000 quantum bits (qubits), which is 75 times the capacity of current quantum computers. In quantum computing, qubits are Read more ›

6-15 #GoodARGlasses : Samsung Foundry has unveiled its new roadmap for chipmaking process technologies; Samsung has demonstrated its color e-paper display; Apple is expanding the capabilities of its satellite messaging on the iPhone; etc.

Samsung Foundry has unveiled its new roadmap for chipmaking process technologies outlining plans for 2nm-class nodes, a 1.4nm-class node. In 2025, Samsung will launch its SF2 node, previously known as SF3P, which demonstrated power, performance, and area (PPA) which the Read more ›

6-7 #Rain : OPPO is committed to “making AI phones accessible to everyone”; Samsung has pre-emptively filed its own suit against Oura; Apple has allegedly tapped Samsung Display and LG Display to develop foldable display; etc.

Tsinghua University’s Department of Precision Instruments has unveiled a new computer chip inspired by the human brain that they say could revolutionize artificial intelligence applications like self-driving cars and smartphones. Tianmoc chip tackles a key challenge for AI: visual perception Read more ›

6-2 #HeKnows : TSMC has scheduled its N3P node to enter mass production in 2H24; Samsung will allegedly implement a thicker UTG on new Flip; T-Mobile is buying U.S. Cellular’s wireless operations and certain spectrum assets; etc.

MediaTek has announced two new midrange chips – the Dimensity 7300 and Dimensity 7300X. Both the MediaTek Dimensity 7300 and Dimensity 7300X are fabricated on a 4nm process node and offer an octa-core CPU. It consists of 4 x Cortex-A78 Read more ›

5-26 #Future : Samsung has already started the development of a 2nm chipset; Samsung Display is reportedly collaborating with Lenovo to develop slidable display devices; TCL has unveiled the world’s first 7.85” tri-foldable smartphone; etc.

Samsung Electronics has already started the development of a 2nm chipset as competition with Apple and TSMC heats up. Samsung has said it would mass-produce the 2nm process for mobile applications in 2025. The process is claimed to showcase a Read more ›

5-11 #GoHome : Apple reportedly has struck an agreement with Samsung Display for foldable display; Apple has cut its 2024 Vision Pro shipments to 400K–450K units; Apple is studying the possibility of working with an electric vehicle (EV) startup company; etc.

Apple reportedly has been working on its own chip designed to run artificial-intelligence (AI) software in data-center servers. Project ACDC (Apple Chips in Data Center) has been in the works for several years. Apple’s server chip will likely be focused Read more ›

5-5 #Embrace : Samsung is currently developing next-gen GAA technology; Two major international manufacturers in China have stopped updating their small foldable phone lines; Apple has allegedly renewed discussions with OpenAI; etc.

Samsung Electronics is currently developing next-generation “gate-all-around” (GAA) technology, aimed for application in the 2nm foundry processes it plans to mass produce in 2025. GAA technology is a next-generation transistor technology that regulates and amplifies or switches off the flow Read more ›

5-1 #HappyLaborDay : TSMC has announced its “A16” will enter production in 2H26; Samsung Electronics is deepening ties with Zeiss Group; ASML will no longer service certain chipmaking equipment purchased by Chinese customers; etc.

Taiwan Semiconductor Manufacturing Co (TSMC) has announced that a new chip manufacturing technology called “A16” will enter production in 2H26. The announced 1.6nm process relies on gate-all-around nanosheet transistors, just like the upcoming N2, N2P and N2X architectures based on Read more ›

4-26 #VIPs : vivo has unveiled “BlueImage” brand; Oura is aggressively expanding its retail footprint in the US; Meta has announced that the operating system Horizon OS; etc.

Qualcomm expands the Snapdragon X Series platform portfolio with Snapdragon X Plus. Snapdragon X Plus features the state-of-the-art Qualcomm Oryon CPU, a custom-integrated processor that delivers up to 37% faster CPU performance compared to competitors, while consuming up to 54% Read more ›

4-13 #Gamer : Apple is allegedly focusing on foldable products; OPPO, OnePlus, and realme are reportedly working on the ultrasonic FoD; Huawei is reportedly building a giant R&D center near Shanghai; etc.

Intel and Altera have announced new AI-optimized processors and field programmable gate arrays (FPGAs) for edge computing. By introducing a range of edge-optimized Intel Core Ultra processors, Intel Core processors, and Intel Atom processors, alongside Agilex 5 FPGAs, the companies Read more ›