9-24 #BadCold : Apple’s 5G modem prototype is reportedly “3 years behind Qualcomm”; Nio has unveiled its first smartphone in China; Li Auto clarified that the company has no plans to launch a smartphone; etc.

The U.S. Department of Defense (DoD) has entered into a 10-year agreement with GlobalFoundries (GF) to procure U.S. chips for vital defense and aerospace applications. The initial commitment is valued at USD17.3M, with the potential to reach USD3.1B over the Read more ›

9-20 #Fatigue : Huawei is rumored developing a tri-fold display phone; Samsung is hinting at 200Mp telephoto cameras coming to phones; Tesla has announced that it has produced its 5M-th electric car; etc.

TSMC is said to be cautious about the outlook for customer demand and has notified major suppliers, including Dutch chip production equipment giant ASML, to postpone the delivery of high-end chip manufacturing equipment to TSMC, but the delay is expected Read more ›

9-14 #Headache : TSMC’s chips that will be manufactured in the Arizona fab will have to be sent to Taiwan for packaging; Qualcomm has entered into an agreement with Apple to supply Snapdragon 5G Modem for next 3 years; OPPO may announce a free 4-year battery replacement initiative; etc.

Encouraged by the American government, Taiwan Semiconductor Manufacturing Co (TSMC), is making its first factory in the US. Apple plans to buy chips from the Arizona factory. The plant will kick off production of chips by 2024. But things have Read more ›

9-10 #PoorWeekend : Intel plans on taking the help of TSMC in the future; Samsung will allegedly equip its future mid-range chips with AMD GPU; China is reportedly set to launch a new state-backed investment fund that aims to raise about USD40B for its semiconductor sector; etc.

Intel plans on taking the help of TSMC in the future, as its foundry division becomes a victim of delays and process inefficiencies. Goldman Sachs Securities has noted that Intel has been consistently grappling with process upgrade delays since the Read more ›