IF / News – Daily News / Weekly Summary / Regular Discussion

11-30 #TooOld : Samsung is allegedly rebranding its Exynos to “Dream Chip”; Samsung reportedly will increase prices of its CIS in early 2024; Nvidia CEO Jensen Huang has said that AI will be “fairly competitive” with humans in 5 years; etc.

Chinese chip company Loongson Technology has unveiled its latest self-developed central processing unit (CPU) 3A6000, which can be used in multiple applications across different platforms. It has 4 physical cores / 8 logic cores, main frequency 2.0-2.5GHz. Loongson 3A6000 adopts… Read more ›

11-25 #Drive : Honor is preparing for an IPO; Baidu has reportedly ordered AI chips from Huawei; Nvidia is reportedly delaying the launch of a new AI chip; etc.

MediaTek has announced Dimensity 8300, which is fabed on TSMC’s second-generation 4nm process. Dimensity 8300 features 4x Arm Cortex-A715 performance cores clocked at up to 3.35GHz alongside 4x Arm Cortex-A510 efficiency units at up to 2.2GHz clock speeds. All eight… Read more ›

11-21 #SoWhat : MediaTek has announced a new partnership with Meta; Samsung claims no plan to produce mid-range foldable; Samsung has reportedly excluded BOE from its supply chain; etc.

Apple has fallen further behind in its multibillion-dollar effort to make a modem chip for the iPhone, stymied by the complexity of replacing an intricate Qualcomm component. After already delaying a plan to have an in-house chip ready by 2024,… Read more ›

11-12 #BadEyes : Samsung is reportedly working on mid-range Galaxy foldables for 2024; OPPO and Hasselblad announced next-gen HyperTone Camera System; Samsung is to expand NAND production cuts by 40-50% by 1H24; etc.

In response to the global shortage of GPUs, Fujitsu has developed “Adaptive GPU Allocator Technology”, a technology that can automatically switch between CPU and GPU computing resources in real time even during program processing. This technology can allocate GPUs in… Read more ›

11-7 #NoWar : Samsung Display sues BOE; Changxin Xinqiao Memory Technologies has raised CNY39B; Samsung will allegedly be using a frame case made out of titanium in its upcoming Galaxy S24; etc.

Apple’s A17 processor was the first chip to use TSMC’s N3 (3nm-class) process technology, the company has expanded its N3 lineup with a family of PC-oriented M3 chips for desktop and laptop computers. Analyst Jay Goldberg from Digits to Dollars… Read more ›

11-3 #TidyUp : Samsung has worked with AMD and Qualcomm to jointly develop FSR; YMTC has developed and mass-produced 232-layer 3D NAND flash; Samsung plans to unveil a smartphone with integrated generative artificial intelligence (AI) technology in 2024; etc.

Samsung Electronics has allegedly received an order for Google’s upcoming Tensor G4 SoC, which will make its way to the Pixel 9 series. The Tensor G4 will feature an improved CPU from the G3. It bears an internal project codename… Read more ›

10-26 #Whatsthepoint : Nvidia and AMD are reportedly planning to launch Arm-based CPUs; Samsung is allegedly planning to apply gOLED to the low-cost smartphone; Motorola has introduced a concept device equipped adaptive display technology; etc.

Qualcomm has announced the Snapdragon 8 Gen 3 flagship platform. It all starts with the AI Engine, which supports multi-modal generative AI models and popular large language models for speech recognition – the chip can run up to 20 tokens… Read more ›

10-21 #Hiking : Nio’s first self-developed chip will go into mass production in Oct 2023; Intel has announced a new initiative, the AI PC Acceleration Program; Nokia is to cut 9,000-14,000 jobs by the end of 2026 to cut costs; etc.

Huawei allegedly to launch Kirin 830, which will be adopted by its nova 12 series to be expected by end of 2023. The performance of the Kirin 830 is rumored to be on par with Snapdragon 778G or Snapdragon 870… Read more ›

10-19 #NeverForget : Nvidia is collaborating with Hon Hai to accelerate the AI industrial revolution; Xiaomi has announced HyperOS; Apple is reportedly working with suppliers to develop a foldable iPad; etc.

Qualcomm has announced that they are building on their long-standing collaboration with Google by bringing a RISC-V based wearables solution for use with Wear OS by Google. Qualcomm refers to its chips as platforms and sums up the benefit of… Read more ›

10-13 #StayBlank : MediaTek has collaborated with OPPO and ColorOS; Huawei is reportedly to increase the shipment of its smartphone sales in 2024; vivo and Transsion are allegedly to unveil rollable phone by end of 2024; etc.

Qualcomm has announced its new Snapdragon X Series platform for PC. Snapdragon X Series features Qualcomm’s in-house built Oryon CPU, created by the Nuvia team of ex-Apple engineers that Qualcomm acquired in early 2021 for USD1.4B. The Snapdragon X series… Read more ›

10-9 #BeGrateful : Samsung is reportedly developing a slim foldable laptop with a unique waterdrop hinge; Samsung ring to be delayed till 3Q24 or 1Q25; VinFast Auto is planning to set up assembly units in India and Indonesia; etc.

According to IDC VP Francisco Jeronimo, Google Pixel has shipped 37.9M phones in 2016-2023 – the entire lifecycle of the Pixel lineup thus far. Jeronimo notes that sales are growing in “double digits” in recent years. While that is not… Read more ›

10-7 #CestLaVie : Intel will begin mass production of 1.8nm chips in 2025; Samsung is reportedly developing two near-1″ high-res CIS; Samsung is reportedy to increase prices of NAND products over 10% during 4Q23; etc.

The Semiconductor Industry Association (SIA) has announced global semiconductor industry sales totaled USD44.0B during the month of Aug 2023, an increase of 1.9% compared to the July 2023 total of USD43.2B but 6.8% less than the Aug 2022 total of… Read more ›

10-6 #Holiday2Short : TSMC’s 2nm chips might be delayed until 2026; SMIC has reportedly placed big orders for the raw materials of HiSilicon Kirin 9000S chip; Google Pixel 8 series will be supported with 7 years of “OS, security, and Feature Drop updates”; etc.

TSMC’s highly anticipated 2nm chips might be delayed until 2026, despite initial promises of a 2025 launch. The move to 2nm is crucial for TSMC as it plans to transition from FinFET transistors to Gate-all-around (GAA) technology, aiming for lower… Read more ›

9-24 #BadCold : Apple’s 5G modem prototype is reportedly “3 years behind Qualcomm”; Nio has unveiled its first smartphone in China; Li Auto clarified that the company has no plans to launch a smartphone; etc.

The U.S. Department of Defense (DoD) has entered into a 10-year agreement with GlobalFoundries (GF) to procure U.S. chips for vital defense and aerospace applications. The initial commitment is valued at USD17.3M, with the potential to reach USD3.1B over the… Read more ›

9-20 #Fatigue : Huawei is rumored developing a tri-fold display phone; Samsung is hinting at 200Mp telephoto cameras coming to phones; Tesla has announced that it has produced its 5M-th electric car; etc.

TSMC is said to be cautious about the outlook for customer demand and has notified major suppliers, including Dutch chip production equipment giant ASML, to postpone the delivery of high-end chip manufacturing equipment to TSMC, but the delay is expected… Read more ›

9-14 #Headache : TSMC’s chips that will be manufactured in the Arizona fab will have to be sent to Taiwan for packaging; Qualcomm has entered into an agreement with Apple to supply Snapdragon 5G Modem for next 3 years; OPPO may announce a free 4-year battery replacement initiative; etc.

Encouraged by the American government, Taiwan Semiconductor Manufacturing Co (TSMC), is making its first factory in the US. Apple plans to buy chips from the Arizona factory. The plant will kick off production of chips by 2024. But things have… Read more ›