IF / News – Daily News / Weekly Summary / Regular Discussion

6-3 #MorePraises : Qualcomm may exclusively use TSMC’s N3E for 8 Gen 4; Qualcomm reportedly discusses with Nintendo and Sony to develop hardware; Dixon Technologies is partnering with Xiaomi’s Indian; etc.

Tenstorrent and LG Electronics have announced that they are collaborating to build a new generation of RISC-V, AI, and video codec chiplets to potentially power LG’s premium TV and automotive products of the future and Tenstorrent’s data center products. Through… Read more ›

5-31 #TooOld : Samsung is developing XR processor chips; Nvidia and MediaTek have said they will collaborate; realme may discontinue its sub-brand DIZO; etc.

Apple has recently filed a trademark for “SignChat” to provide sign language services. SignChat is a new accessibility service that provides info related to sign language. It is designed to help people who are deaf or hard of hearing to… Read more ›

5-28 #Old : MediaTek will form an alliance with Nvidia; TSMC is in talks with German authorities for up to 50% subsidies; Sony has announced its plan to acquire a land in Kumamoto Prefecture; etc.

MediaTek will form an alliance with Nvidia and announce related cooperation such as Windows on Arm PC chips. Through this cooperation, Nvidia will return to the Arm-based PC market and the long-coveted mobile phone chip market, and MediaTek will also… Read more ›

5-26 #HotCoffee : Arm is seeking to raise prices for its chip designs; Sony is allegedly working on its first clamshell foldable smartphone; China has said Micron’s product has failed its network security review; etc.

Apple has announced a new multiyear, multibillion-dollar agreement with Broadcom. Through this collaboration, Broadcom will develop 5G radio frequency components — including FBAR filters — and cutting-edge wireless connectivity components. A Film Bulk Acoustic Resonator (FBAR) filter is a bulk… Read more ›

5-21 #SummerHeat : Seven largest semiconductor makers have set out plans to increase manufacturing and deepen tech partnerships in Japan; Canon is allegedly looking to partner up with a smartphone maker; Samsung has notified its distributors that it will no longer sell DRAM chips below the current price; etc.

Seven of the world’s largest semiconductor makers have set out plans to increase manufacturing and deepen tech partnerships in Japan as western allies step up efforts to reshape the global chip supply chain amid rising tensions with China. Micron said… Read more ›

5-20 #GettingOlder : MediaTek is expected to integrate an Nvidia GPU into its SoC; Samsung Display has acquired micro-LED maker eMagin; Vodafone would cut 11,000 jobs over 3 years; etc.

Apple is testing an M3 chipset with a 12-core processor and 18-core GPU, according to Bloomberg’s Mark Gurman. He speculates the M3 variant Apple is testing is the base-level M3 Pro the company plans to release sometime in 2023. The… Read more ›

5-14 #HaveOurBacks : OPPO may be forced to cease all operations and pull out of France; OPPO is shutting down its ZEKU chip unit; Samsung plans its next few gen of S Ultra to use 200Mp; etc.

OPPO is allegedly shutting down its ZEKU chip unit, which made MariSilicon chips. ZEKU covers product lines including core application processors, short-distance communication, 5G Modem, radio frequency, ISP and power management chips, etc. Founded in 2019, ZEKU focuses on providing… Read more ›

5-7 #OfftheGrid : Honda Motor collaborates TSMC to ensure a “stable” supply of chips; iPhone 15 Pro models will no longer feature solid-state buttons; Tesla has begun producing the Model Y SUV with a Blade battery from BYD; etc.

Global semiconductor revenue is projected to decline 11.2% in 2023, according to the latest forecast from Gartner. In 2022, the market totaled USD599.6B, which was marginal growth of 0.2% from 2021. The short-term outlook for the semiconductor market has deteriorated… Read more ›

5-4 #BetterTomorrow : Samsung is expected to increase its spending to raise wafer input for R&D; TSMC’s Arizona wafer cost may be 20-30% higher; JOLED has filed for bankruptcy protection; etc.

Samsung is expected to increase its spending to raise wafer input for research and development. Kyung Kye-hyun, Samsung’s Device Solutions Division CEO overseeing global memory operations, System LSI, has said the company will increase its wafer input to “gain the… Read more ›

4-30 #Happy5-1 : Qualcomm is allegedly considering a dual-sourcing strategy for future high-end chipsets; Bosch is expanding its semiconductor business with silicon carbide chips; General Motors and Samsung SDI to build a new battery cell manufacturing plant in the US; etc.

German security company Nitrokey has recently released a report claiming that it has discovered an unrecorded feature in Qualcomm Snapdragon chips that collects and transmits user information directly to Qualcomm servers. Nitrokey installed a Google-free version of Android on a… Read more ›

4-29 #BFF : Arm will team up with manufacturing partners to develop the new semiconductor; Samsung is allegedly planning to bring back Exynos SoCs to its S series; Apple will reportedly start using microLED panels as early as 2024; etc.

Arm is reportedly building its own semiconductor to showcase the capabilities of its products, as it seeks to attract new customers and fuel growth following its Initial Public Offering (IPO) later in 2023. Arm will team up with manufacturing partners… Read more ›

4-22 #MissHim : TSMC seeks up to USD15B from US government; GlobalFoundries has filed a lawsuit against IBM; Alphabet is merging an internal Google Research team called Brain with DeepMind; etc.

The global smartphone market experienced a fifth consecutive quarter of decline, falling by 12% YoY in 1Q23. Despite limited improvements in major unfavorable macro factors, the market is yet to recover. Samsung was the only leading vendor to achieve a… Read more ›

4-15 #BadFlu : Intel has partnered with Arm to build low-power compute SoCs; vivo may be stopped from selling phones in Germany; Samsung’s first foldable tablet to be launched this year; etc.

Intel has revealed that Intel Foundry Services (IFS) has partnered with Arm to build low-power compute SoCs on the Intel 18A process. The Intel 18A process is a plan to introduce five increasingly advanced semiconductor manufacturing process technologies in five… Read more ›

4-9 #HappyEaster : Samsung Z Flip5 will allegedly feature a bigger cover display; Samsung has announced that it will reduce its chip production; Huawei founder Ren Zhengfei has said “Huawei or HUAWEI” words cannot be used by any vehicle publicity or design; etc.

A new report from SellCell examines the latest handsets from all three companies, which include the lineups for the iPhone 14, Samsung S23, and Google’s Pixel 7 devices. The current iPhone series continued to hold its value the best, with… Read more ›

4-8 #Flexible : Samsung and AMD have signed a multi-year agreement extension; OPPO has developed 300W level of rapid charging; vivo is reportedly merging its sub-brand iQOO into its main business; etc.

Google has previously used the Google Now Launcher for its Nexus line of phones in the early 2010s, also making this software available to phones from other brands. According to the latest Google beta app (version 14.14), the launcher will… Read more ›

3-26 #Heading50 : TSMC’s new plant in Arizona will start producing 4nm chips from 2024; Arm is planning price hikes for some of its biggest customers as it implements a new business model; Pegatron is reportedly in talks to open a second India factory; etc.

NVIDIA has announced that BYD, the world’s leading manufacturer of new energy vehicles (NEVs), will extend its use of the NVIDIA DRIVE Orin centralized compute platform in a broader range of its NEVs. The enhanced partnership expands BYD’s use of… Read more ›