7-28 #Neat : Intel will begin making chips for Qualcomm and Amazon; Samsung has confirmed there will not be a Galaxy Note 21 in 2021; LG has confirmed that it will begin selling Apple products like iPhones at its South Korean stores; etc. Posted on 2021-07-282021-07-28 By 老年 Advertisements Advertisements
7-24 #Balding : Intel claims it is now manufacturing more 10nm wafers than 14nm; Corning is launching Gorilla Glass optimized for smartphone camera lenses; Samsung has announced it is expanding its portfolio of Software-Defined Networking (SDN); etc. Posted on 2021-07-24 By 老年
7-23 #Helpless : ARM has detailed what it says is the first functional ARM processor based on a flexible non-silicon design; TSMC is finalizing a decision to put its first chip plant in Japan into operation as early as 2023; etc. Posted on 2021-07-23 By 老年
7-20 #Typhoon : Robert Bosch GmbH is considering closing a plant in Munich that makes components for cars powered by internal combustion engines; SK Innovation will receive subsidies worth EUR90M (USD106.2M) from the European Union for its second battery factory in Hungary; etc. Posted on 2021-07-20 By 老年
7-17 #What’sThePoint : TSMC’s Arizona plant with USD12B investment has been expected to begin production in 1Q24; Intel is allegedly in talks to buy semiconductor manufacturer GlobalFoundries for about USD30B; MediaTek has announced Helio G96 and G88; etc. Posted on 2021-07-17 By 老年
7-15 #MultiScreens : Samsung Electronics has introduced ISOCELL Auto 4AC; LG InnoTek and Corning are collaborating in the research of liquid lens; OPPO has announced that its new factory in Istanbul, Turkey; etc. Posted on 2021-07-15 By 老年
7-12 #DailyLife : Huawei has achieved the tape out of HiSilicon’s first OLED driver IC in 2H20; OPPO and vivo will reportedly be making their entry into the tablet market in 2021; etc.SEMCO has indicated that the company was researching metalens; Posted on 2021-07-12 By 老年
7-10 #FxxkDelta : Tsinghua Unigroup has confirmed that one of its creditors has asked a court to begin bankruptcy proceedings for the group; OnePlus expects to sell 25M smartphones of the Nord series before the end of 2023; etc. Posted on 2021-07-10 By 老年
7-9 #Stop : OnePlus has been accused of throttling some of the most popular Android apps; Huawei has announced it has reached a license agreement with a supplier of Volkswagen Group; TSMC is allegedly coming under pressure from the US over its plan to expand foundry capacity in China; etc. Posted on 2021-07-09 By 老年
7-6 #Innocence : Wingtech’s Nexperia has acquired Newport Wafer Fab; OPPO is allegedly developing its own image signal processor (ISP); OnePlus has revealed that it is merging its OxygenOS with OPPO’s ColorOS; etc. Posted on 2021-07-06 By 老年
7-3 #Dryer : realme is allegedly partnering with a veteran camera company; Micron has predicted that the global computer chip shortage will continue at least into 2022; TSMC and UMC, and SMIC, have all stepped up their capacity expansions particularly for 28nm process; etc. Posted on 2021-07-03 By 老年
7-1 #Pressure : SK Hynix will set out at M16 facility investment of KRW800B (about USD709M); MediaTek has announced the Dimensity 5G Open Resource Architecture; TI has announced it has signed an agreement to acquire Micron’s 300mm semiconductor factory in Lehi; etc. Posted on 2021-07-01 By 老年
6-30 #AlwaysLearning : Qualcomm has announced Snapdragon 888+; Samsung Foundry tapes out 3nm GAA chip; Foxconn’s platform for electric vehicles will feature driver assistance technology; etc. Posted on 2021-06-30 By 老年
6-27 #Principles : Huawei will set up its first wafer fab in Wuhan with production expected to kick off in phases starting 2022; Biren Technology’s first 7nm GPU is expected to tape out in 3Q21 and will be officially released in 2022; Tesla would ‘recall’ nearly 300,000 China-made and imported Model 3 and Model Y cars; etc. Posted on 2021-06-27 By 老年
6-26 #Running : Jio will launch the first 5G network in India; BOE has stated that the Gen-10.5 TFT-LCD production line in Wuhan is ramping up production; Baidu’s AI chip unit Kunlun has been spun off as a standalone company; etc. Posted on 2021-06-26 By 老年
6-24 #Filled : Intel has also announced that it would adopt SiFive designs for use in its future 7nm Horse Creek platforms; GF is starting with the construction of phase one of its 300mm fab expansion in Singapore; Samsung has unveiled a range of new chipsets that will be embedded into the company’s next generation 5G solutions; etc. Posted on 2021-06-24 By 老年
