9-18 #Home : TCL will invest more than CNY20B (USD3.1B) in the next 5 years; Infineon has announced the opening of its new EUR1.6B, 300mm, or 12” wafer semiconductor factory; Samsung SDI is reviewing potential ways to secure funding to invest in its battery business; etc. Posted on 2021-09-18 By 老年 Advertisements Advertisements
9-17 #Soon : GlobalFoundries will incur an additional USD6B to expand its overall production capacity; Apple has reportedly conditionally approved BOE to supply display panels to the iPhone 13; Foxconn to team up with PTT Public Co to invest USD1-2B in launching an electric vehicle (EV) joint venture in Thailand; etc. Posted on 2021-09-17 By 老年
9-14 #Break : Qualcomm’s SM6375 is expected to launch in four variants; A U.S. federal judge has struck down some of Apple’s App Store rules; DC’s Attorney General has filed a lawsuit against Amazon; etc. Posted on 2021-09-14 By 老年
9-11 #LovedOne : UMC is talking about the production capacity in 2022; Samsung Display has unveiled a new 13” stretchable OLED display prototype that can stretch vertically; Apple is reportedly to move to under-display Face ID technology in 2022; etc. Posted on 2021-09-11 By 老年
9-8 #WTH : vivo has officially launched its first self-developed ISP chip vivo V1; Qualcomm is working with Google and Renault to design an in-vehicle experience; LG Chem has developed Real Folding Window technology; etc. Posted on 2021-09-08 By 老年
9-4 #OneGo : SMIC to invest USD8.87B to increase production capacity; SK Hynix is supplying its CIS for Samsung’s Galaxy Z Fold 3; Samsung will allegedly roll out OIS to its entire Galaxy A series in 2022; etc. Posted on 2021-09-04 By 老年
9-2 #Merdeka : TSMC will seek the equipment and material suppliers to reduce the price by at least 15%; Google reportedly plans to roll out the CPUs for laptops and tablets; OPPO’s ISP of its chip subsidiary ZEKU has already been taped out in early 2021; etc. Posted on 2021-09-02 By 老年
8-30 #Lift : TSMC has confirmed that the shifted N3 (3nm) cadence is due to a delay; Xiaomi 12 generation allegedly to feature triple 50MP setup; Honor has just officially announced that it has opened its global headquarters in Shenzhen, China; etc. Posted on 2021-08-30 By 老年
8-27 #Weekend : Samsung Electronics is expected to raise foundry prices in the near term; VinTech-backed Spanish phone maker BQ files for bankruptcy; FIH Mobile and Stellantis have announced that they have entered into a joint venture agreement; etc. Posted on 2021-08-27 By 老年
8-26 #Running : TSMC plans to increase the price of wafer in 2022; OPPO might be bringing back its N series line of premium smartphones; Samsung Group will invest KRW240T in the next 3 years; etc. Posted on 2021-08-26 By 老年
8-24 #Displays : Tesla has unveiled a custom chip for training AI networks in data centers D1; vivo may launch its proprietary ISP dubbed “Yueying” in Sept 2021; Samsung allegedly will not launch any new Galaxy Note smartphones in the future; etc. Posted on 2021-08-24 By 老年
8-21 #Older : Nvidia expects supply constraints of GPU for the majority of 2022; Intel has just launched its 12th generation of CPUs codenamed “Alder Lake”; Google is reportedly dismantling its health technology initiative; etc. Posted on 2021-08-21 By 老年
8-19 #Happy : Intel has announced the launch of a graphics division which will be called Arc; LGD will spend KRW3.3T to expand its small- to mid-sized OLED production capacity; OPPO has showcased several new camera technologies; etc. Posted on 2021-08-192021-08-19 By 老年
8-17 #Positive : Qualcomm’s next generation SoC Snapdragon 898 is allegedly using Samsung’s 4nm process; TSMC’s 3nm process is on track for volume production in 2H22; Samsung Display has announced its latest OLED panel Eco²OLED; etc. Posted on 2021-08-17 By 老年
8-13 #Life : MediaTek has announced Dimensity 920 and 810; TCL CSOT will have 9 production lines in 2024; Foxconn is reportedly in negotiations with three states in the U.S. to build EV plants; etc. Posted on 2021-08-13 By 老年
8-10 #HalfFull : TSMC has reported a surge in demand for its 7nm and 5nm chip manufacturing; TSMC continues to sprint 3nm and expects mass production in 2H22; TSMC has moved to maintain the prices throughout 2H21 of its 28nm; etc. Posted on 2021-08-10 By 老年
