Intel, AMD, Samsung, LG Innotek, and SKC’s US subsidiary Absolics have all highly focused on glass substrate technology for advanced packaging. Intel stated that glass substrates could lay the foundation for achieving an astounding one trillion transistors on a single… Read more ›
Google’s Tensor G4 might be the last SoC that is mass produced by Samsung Foundry, as the Tensor G5 is said to leverage TSMC’s cutting-edge 3nm process when it powers the upcoming Pixel 10 series in late 2025. Since Samsung’s… Read more ›
Samsung is developing a new chip package technology to prevent overheating in application processors (AP). The package attaches a heat path block, or HPB, on top of the SoC, and is expected to be used on future Exynos chips, sources… Read more ›
According to Chris Patrick, SVP and General Manager of Handsets at Qualcomm, the company has been working on making Android version updates and security updates easier for quite a while. One of the things they been working on for the… Read more ›
Huawei Technologies is reportedly building a massive semiconductor equipment research and development center in Shanghai. The center’s mission includes building lithography machines, vital equipment for producing cutting-edge chips. Total investment for the the entire R&D base will come to about… Read more ›
Samsung Electronics’ semiconductor chip factory in Taylor, Texas, USA, reportedly will not be operational until 2026. The company had announced its plans to invest USD17B to set up this chip factory, but it had to invest more as construction costs… Read more ›
The National Institute of Advanced Industrial Science and Technology (AIST) in Japan and IBM aim to develop a quantum computer with 10,000 quantum bits (qubits), which is 75 times the capacity of current quantum computers. In quantum computing, qubits are… Read more ›
Samsung Foundry has unveiled its new roadmap for chipmaking process technologies outlining plans for 2nm-class nodes, a 1.4nm-class node. In 2025, Samsung will launch its SF2 node, previously known as SF3P, which demonstrated power, performance, and area (PPA) which the… Read more ›
Qualcomm has launched the Snapdragon 6s Gen 3 SoC. It is available in a 4G (SM-6370) and a 5G (SM6375-AC) variant. The Snapdragon 6s Gen 3 is based on a 6nm TSMC node. It has two CPU clusters: one with… Read more ›
Tsinghua University’s Department of Precision Instruments has unveiled a new computer chip inspired by the human brain that they say could revolutionize artificial intelligence applications like self-driving cars and smartphones. Tianmoc chip tackles a key challenge for AI: visual perception… Read more ›
MediaTek has announced two new midrange chips – the Dimensity 7300 and Dimensity 7300X. Both the MediaTek Dimensity 7300 and Dimensity 7300X are fabricated on a 4nm process node and offer an octa-core CPU. It consists of 4 x Cortex-A78… Read more ›
Samsung Electronics has already started the development of a 2nm chipset as competition with Apple and TSMC heats up. Samsung has said it would mass-produce the 2nm process for mobile applications in 2025. The process is claimed to showcase a… Read more ›
Apple reportedly has been working on its own chip designed to run artificial-intelligence (AI) software in data-center servers. Project ACDC (Apple Chips in Data Center) has been in the works for several years. Apple’s server chip will likely be focused… Read more ›
Samsung Electronics is currently developing next-generation “gate-all-around” (GAA) technology, aimed for application in the 2nm foundry processes it plans to mass produce in 2025. GAA technology is a next-generation transistor technology that regulates and amplifies or switches off the flow… Read more ›
Taiwan Semiconductor Manufacturing Co (TSMC) has announced that a new chip manufacturing technology called “A16” will enter production in 2H26. The announced 1.6nm process relies on gate-all-around nanosheet transistors, just like the upcoming N2, N2P and N2X architectures based on… Read more ›
Qualcomm expands the Snapdragon X Series platform portfolio with Snapdragon X Plus. Snapdragon X Plus features the state-of-the-art Qualcomm Oryon CPU, a custom-integrated processor that delivers up to 37% faster CPU performance compared to competitors, while consuming up to 54%… Read more ›