11-30 #TooOld : Samsung is allegedly rebranding its Exynos to “Dream Chip”; Samsung reportedly will increase prices of its CIS in early 2024; Nvidia CEO Jensen Huang has said that AI will be “fairly competitive” with humans in 5 years; etc.

Chinese chip company Loongson Technology has unveiled its latest self-developed central processing unit (CPU) 3A6000, which can be used in multiple applications across different platforms. It has 4 physical cores / 8 logic cores, main frequency 2.0-2.5GHz. Loongson 3A6000 adopts Read more ›

11-12 #BadEyes : Samsung is reportedly working on mid-range Galaxy foldables for 2024; OPPO and Hasselblad announced next-gen HyperTone Camera System; Samsung is to expand NAND production cuts by 40-50% by 1H24; etc.

In response to the global shortage of GPUs, Fujitsu has developed “Adaptive GPU Allocator Technology”, a technology that can automatically switch between CPU and GPU computing resources in real time even during program processing. This technology can allocate GPUs in Read more ›

11-3 #TidyUp : Samsung has worked with AMD and Qualcomm to jointly develop FSR; YMTC has developed and mass-produced 232-layer 3D NAND flash; Samsung plans to unveil a smartphone with integrated generative artificial intelligence (AI) technology in 2024; etc.

Samsung Electronics has allegedly received an order for Google’s upcoming Tensor G4 SoC, which will make its way to the Pixel 9 series. The Tensor G4 will feature an improved CPU from the G3. It bears an internal project codename Read more ›