07-26: Sorry for being absent 2 days again. Samsung wants to capture 25% market share of foundry business; Apple is allegedly building flexible OLED production in Taiwan; etc.

07-21 Week: Shortage of silicon wafer; Number of corps support Apple in dispute with Qualcomm; MediaTek’s worst time is about to over; Xiaomi and Samsung signed OLED deal; etc.

07-23: Baidu and JD.com to jointly invest about USD12B in China Unicom; The NB-IoT module integrates with China Mobile’s eSIM card and supports OneNET, China Mobile’s IoT open platform; etc.

07-21: Lenovo intends to achieve CNY80B of online annual revenue within 3 years; Xiaomi is confident of clocking revenues in excess of USD2B from its India operations in 2017; etc.

07-20: Sorry for not able to provide instant info, on business trip. These few days – Samsung to make Apple chipset next year; Xiaomi signed OLED supply deal with Samsung; etc.

07-16: The shortage of silicon wafer is expected to continue throughout 2018 or even longer; Microsoft is killing off support for Windows Phone 8.1; etc.

07-14 Week: A week has passed quick! Last week review – Huawei AI chipset; TSMC’s 10nm; TCL’s CSOT; Vertu is closing down UK; etc.

07-15: MediaTek has ramped up shipments of its chips for voice assistant devices; TCL Corp. plans to acquire 10.04% stake in Shenzhen China Star Optoelectronics Technology (CSOT); etc.

07-14: Vertu’s UK manufacturing operation will be shut down; TSMC’s 10nm is entering mass production from 3Q17; Lately 16:9 panel orders are reportedly increased; etc.

07-12: Huawei comsumer business CEO Richard Yu indicates that the company is developing AI processor; Samsung wants to claim 2nd place in market shares by the end of 2017; etc.

07-11: Xiaomi may plan a third sub-brand to take on OPPO and vivo in the Chinese market; Faraday Future halted plans to build a USD1B factory in Nevada; etc.

07-07 Week: Already July! Xiaomi has Nokia’s patents; Qualcomm wants to ban Apple from selling iPhone; Sharp invests big in OLED; Apple invests in LGD; etc.

07-09: Intel and Qualcomm are expected to compete neck and neck in the VR/AR and AI sectors; China-based flat panel makers are drawing plans to turn the country into the world’s largest cluster of 10.5/11G panel fabs in the next few years; etc.

07-08: Qualcomm has filed a complaint with ITC against Apple; HMD Global, which now owns the Nokia brand, and Zeiss have announced a new long term development partnership; etc.

07-05: Nokia and Xiaomi said that they have signed a business collaboration agreement and a multi-year patent agreement; Samsung is reportedly developing a voice-activated speaker powered by its digital assistant Bixby; etc.

07-04: Apple is reportedly testing 3D face scanning technology that will enable users to unlock their iPhone; Indian government is set to slap a customs duty of at least 10% on imported mobile phones under the GST regime; etc.

IF / News

Daily News / Weekly Summary / Regular Discussion

07-26: Sorry for being absent 2 days again. Samsung wants to capture 25% market share of foundry business; Apple is allegedly building flexible OLED production in Taiwan; etc.

07-21 Week: Shortage of silicon wafer; Number of corps support Apple in dispute with Qualcomm; MediaTek’s worst time is about to over; Xiaomi and Samsung signed OLED deal; etc.

07-23: Baidu and JD.com to jointly invest about USD12B in China Unicom; The NB-IoT module integrates with China Mobile’s eSIM card and supports OneNET, China Mobile’s IoT open platform; etc.

07-21: Lenovo intends to achieve CNY80B of online annual revenue within 3 years; Xiaomi is confident of clocking revenues in excess of USD2B from its India operations in 2017; etc.

07-20: Sorry for not able to provide instant info, on business trip. These few days – Samsung to make Apple chipset next year; Xiaomi signed OLED supply deal with Samsung; etc.

07-16: The shortage of silicon wafer is expected to continue throughout 2018 or even longer; Microsoft is killing off support for Windows Phone 8.1; etc.

07-14 Week: A week has passed quick! Last week review – Huawei AI chipset; TSMC’s 10nm; TCL’s CSOT; Vertu is closing down UK; etc.

07-15: MediaTek has ramped up shipments of its chips for voice assistant devices; TCL Corp. plans to acquire 10.04% stake in Shenzhen China Star Optoelectronics Technology (CSOT); etc.

07-14: Vertu’s UK manufacturing operation will be shut down; TSMC’s 10nm is entering mass production from 3Q17; Lately 16:9 panel orders are reportedly increased; etc.

07-12: Huawei comsumer business CEO Richard Yu indicates that the company is developing AI processor; Samsung wants to claim 2nd place in market shares by the end of 2017; etc.

07-11: Xiaomi may plan a third sub-brand to take on OPPO and vivo in the Chinese market; Faraday Future halted plans to build a USD1B factory in Nevada; etc.

07-07 Week: Already July! Xiaomi has Nokia’s patents; Qualcomm wants to ban Apple from selling iPhone; Sharp invests big in OLED; Apple invests in LGD; etc.

07-09: Intel and Qualcomm are expected to compete neck and neck in the VR/AR and AI sectors; China-based flat panel makers are drawing plans to turn the country into the world’s largest cluster of 10.5/11G panel fabs in the next few years; etc.

07-08: Qualcomm has filed a complaint with ITC against Apple; HMD Global, which now owns the Nokia brand, and Zeiss have announced a new long term development partnership; etc.

07-05: Nokia and Xiaomi said that they have signed a business collaboration agreement and a multi-year patent agreement; Samsung is reportedly developing a voice-activated speaker powered by its digital assistant Bixby; etc.

07-04: Apple is reportedly testing 3D face scanning technology that will enable users to unlock their iPhone; Indian government is set to slap a customs duty of at least 10% on imported mobile phones under the GST regime; etc.