09-24: Imagination Technologies has agreed to sell itself to Canyon Bridge; Intel is canceling its plans to release its Project Alloy reference design; etc.

09-22: Google said it would pay USD1.1B in cash to acquire the division at HTC; Toshiba has agreed to sell its prized semiconductor business to a group led by U.S. private equity firm Bain Capital; etc.

09-20: MediaTek reportedly has finished the design of AI computing unit in the mobile phone SoC; PlayNitride will start trial mass production of mobile micro-LED panels as early as 2H17; etc.

09-19: Apple iPhone X components cost an estimated USD581; Samsung is rumoured to use a modular design on the Galaxy S9; etc.

09-18: Qualcomm expects auto to be a big area of innovation over the next decade; MediaTek is expected to complete development of its 5G prototype chip by the end of 2017; etc.

09-17: Haitong Securities consolidating 3D imaging sensors forecast, supply chain and component costs; etc.

09-15 Week: Last week simple review – Apple iPhone X BOM cost is USD413; Qualcomm and Nokia, Huawei and MediaTek both have their 5G trial tests; etc.

09-16: Huawei has changed its strategy in Kenya to showcase an affordable USD100~200 range of smart phones; Apple iPhone X BOM cost is allegedly USD412.75; etc.

09-14: Toshiba has agreed to negotiate with a group led by Bain Capital; Apple is allegedly in talks to provide capital to Bain for an equity stake in Toshiba’s chip business; etc.

09-12: Samsung plans to launch foldable Galaxy Note next year; Second hand platform Zhuan Zhuan signed a strategic deal with Foxconn; etc.

09-11: HTC indicates “full display technology” is not difficult, and the company will continue to focus on mid-to-high products; etc.

09-10: Apple has allegedly sought to stop Western Digital from taking control of Toshiba Corp’s chip business; Foxconn is pressing its case to acquire Toshiba Corp’s memory chips business for JPY2.1T; etc.

09-01/08 2-weeks: IFA2017 has a series of new products, with smart AI speakers stealing the show; MediaTek Helio P23/P30; Huawei Kirin 970; etc.

09-09: Meizu will launch full display smartphone next year; TCL will expand BlackBerry in China, but will not abandon TCL brand; etc.

09-07: ZTE and AT&T are rumored to try and deliver foldable phone with the Axon Multy; Qualcomm confirms under-display fingerprint technology to be launched in 2018; etc.

09-05 [IFA2017]: A series of new smart speakers are launched or showcased; TCL Communication Chairman Li Dongsheng indicates that the company aims to become Europe top 3 by 2020; etc.

IF / News

Daily News / Weekly Summary / Regular Discussion

09-24: Imagination Technologies has agreed to sell itself to Canyon Bridge; Intel is canceling its plans to release its Project Alloy reference design; etc.

09-22: Google said it would pay USD1.1B in cash to acquire the division at HTC; Toshiba has agreed to sell its prized semiconductor business to a group led by U.S. private equity firm Bain Capital; etc.

09-20: MediaTek reportedly has finished the design of AI computing unit in the mobile phone SoC; PlayNitride will start trial mass production of mobile micro-LED panels as early as 2H17; etc.

09-19: Apple iPhone X components cost an estimated USD581; Samsung is rumoured to use a modular design on the Galaxy S9; etc.

09-18: Qualcomm expects auto to be a big area of innovation over the next decade; MediaTek is expected to complete development of its 5G prototype chip by the end of 2017; etc.

09-17: Haitong Securities consolidating 3D imaging sensors forecast, supply chain and component costs; etc.

09-15 Week: Last week simple review – Apple iPhone X BOM cost is USD413; Qualcomm and Nokia, Huawei and MediaTek both have their 5G trial tests; etc.

09-16: Huawei has changed its strategy in Kenya to showcase an affordable USD100~200 range of smart phones; Apple iPhone X BOM cost is allegedly USD412.75; etc.

09-14: Toshiba has agreed to negotiate with a group led by Bain Capital; Apple is allegedly in talks to provide capital to Bain for an equity stake in Toshiba’s chip business; etc.

09-12: Samsung plans to launch foldable Galaxy Note next year; Second hand platform Zhuan Zhuan signed a strategic deal with Foxconn; etc.

09-11: HTC indicates “full display technology” is not difficult, and the company will continue to focus on mid-to-high products; etc.

09-10: Apple has allegedly sought to stop Western Digital from taking control of Toshiba Corp’s chip business; Foxconn is pressing its case to acquire Toshiba Corp’s memory chips business for JPY2.1T; etc.

09-01/08 2-weeks: IFA2017 has a series of new products, with smart AI speakers stealing the show; MediaTek Helio P23/P30; Huawei Kirin 970; etc.

09-09: Meizu will launch full display smartphone next year; TCL will expand BlackBerry in China, but will not abandon TCL brand; etc.

09-07: ZTE and AT&T are rumored to try and deliver foldable phone with the Axon Multy; Qualcomm confirms under-display fingerprint technology to be launched in 2018; etc.

09-05 [IFA2017]: A series of new smart speakers are launched or showcased; TCL Communication Chairman Li Dongsheng indicates that the company aims to become Europe top 3 by 2020; etc.