12-21 #Freezing : Huawei’s new nova will allegedly feature a new Kirin 5G chipset; Samsung has unveiled two new ISOCELL Vizion sensors; LG will unveil its transparent antenna for automobiles; etc.

Huawei has released a new 5nm chip, the Kirin 9006C SoC. Earlier 2023, Huawei achieved a breakthrough with their 7nm ARM processor, the Kirin 9000S. The processor was manufactured by Semiconductor Manufacturing International Corporation (SMIC) and powers the Huawei Mate Read more ›

12-17 #Meaningless : Samsung and ASML have committed to jointly invest KRW1T; Samsung allegedly has its foldable capacity strengthened for Apple; Samsung is allegedly considering a smaller phone than the Galaxy S Ultra; etc.

TrendForce’s research indicates a dynamic third quarter for the global foundry industry, marked by an uptick in urgent orders for smartphone and notebook components. This surge was fueled by healthy inventory levels and the release of new iPhone and Android Read more ›

12-9 #Turbulance : Huawei is allegedly testing two image sensors; LG Innotek has begun development of under panel camera; Tecno has showcased 3 innovative camera technologies; etc.

Chinese artificial intelligence (AI) chip company Shanghai Biren Intelligent Technology has recently received a commitment of CNY2B (about USD280M) from investors backed by the Guangzhou government. The support comes after the company faced blacklisting by the U.S. government. The US Read more ›

12-5 #Humanity : Samsung Galaxy S25 and S25 Plus will allegedly drop ISOCELL; Samsung is reportedly readying a proper 200Mp 1” ISOCELL camera for smartphones; Apple is reportedly planning to include the Action button on the entire iPhone 16 range; etc.

Siemens AG has announced that it signed a Memorandum of Understanding (MoU) with Intel on cooperation in the field of digitalization and sustainability in microelectronics manufacturing. The companies will focus on developing future manufacturing, improving factory operations and cybersecurity, and Read more ›

11-30 #TooOld : Samsung is allegedly rebranding its Exynos to “Dream Chip”; Samsung reportedly will increase prices of its CIS in early 2024; Nvidia CEO Jensen Huang has said that AI will be “fairly competitive” with humans in 5 years; etc.

Chinese chip company Loongson Technology has unveiled its latest self-developed central processing unit (CPU) 3A6000, which can be used in multiple applications across different platforms. It has 4 physical cores / 8 logic cores, main frequency 2.0-2.5GHz. Loongson 3A6000 adopts Read more ›

11-12 #BadEyes : Samsung is reportedly working on mid-range Galaxy foldables for 2024; OPPO and Hasselblad announced next-gen HyperTone Camera System; Samsung is to expand NAND production cuts by 40-50% by 1H24; etc.

In response to the global shortage of GPUs, Fujitsu has developed “Adaptive GPU Allocator Technology”, a technology that can automatically switch between CPU and GPU computing resources in real time even during program processing. This technology can allocate GPUs in Read more ›

11-3 #TidyUp : Samsung has worked with AMD and Qualcomm to jointly develop FSR; YMTC has developed and mass-produced 232-layer 3D NAND flash; Samsung plans to unveil a smartphone with integrated generative artificial intelligence (AI) technology in 2024; etc.

Samsung Electronics has allegedly received an order for Google’s upcoming Tensor G4 SoC, which will make its way to the Pixel 9 series. The Tensor G4 will feature an improved CPU from the G3. It bears an internal project codename Read more ›

10-26 #Whatsthepoint : Nvidia and AMD are reportedly planning to launch Arm-based CPUs; Samsung is allegedly planning to apply gOLED to the low-cost smartphone; Motorola has introduced a concept device equipped adaptive display technology; etc.

Qualcomm has announced the Snapdragon 8 Gen 3 flagship platform. It all starts with the AI Engine, which supports multi-modal generative AI models and popular large language models for speech recognition – the chip can run up to 20 tokens Read more ›

10-13 #StayBlank : MediaTek has collaborated with OPPO and ColorOS; Huawei is reportedly to increase the shipment of its smartphone sales in 2024; vivo and Transsion are allegedly to unveil rollable phone by end of 2024; etc.

Qualcomm has announced its new Snapdragon X Series platform for PC. Snapdragon X Series features Qualcomm’s in-house built Oryon CPU, created by the Nuvia team of ex-Apple engineers that Qualcomm acquired in early 2021 for USD1.4B. The Snapdragon X series Read more ›