08-16: Rockchip and SenseTime have jointly announced strategic collaboration; OPPO R17 Pro shooter can reportedly switch between f/1.5 and f/2.4; etc. 2018-08-16 老年 Uncategorised
08-14: Samsung has revealed that it wishes to become the first in the world to release an operational foldable smartphone; Samsung is reportedly considering to shutdown one of its two smartphone manufacturing units in China; etc. 2018-08-14 老年 Uncategorised
08-11: Qualcomm has reached a settlement with Taiwan’s antitrust regulators that reverses most of a USD773M fine; BOE Technology is making preparations for trial production of micro-OLED panels for AR/VR applications; etc. 2018-08-11 老年 Uncategorised
08-09: Qualcomm announcing Snapdragon 670; Xiaomi officially announcing POCO sub-brand; etc. 2018-08-09 老年 Uncategorised
08-08: Holitech Technology would invest about USD200M in 3 years in India; Huawei reportedly will monopolize Qualcomm’s 2nd-gen ultrasonic fingerprint technology for several months; etc. 2018-08-08 老年 Uncategorised
08-07: TSMC is close to returning its production lines back to normal; Google Android P Pie is official; etc. 2018-08-07 老年 Uncategorised
08-03 Week: Time flies, August is here, summer is already half way through… 2018-08-05 老年 Uncategorised
08-05: TSMC has shut down several of its factories last night after it its systems were hit by a computer virus; ) is allegedly collaborating with “a global OEM” to produce a foldable panel for one of its traditional partners; etc. 2018-08-05 老年 Uncategorised
08-03: Tesla is creating its own chips optimized for machine learning; Starbucks has officially struck a partnership with Alibaba Group; etc. 2018-08-03 老年 Uncategorised
08-02: Sharp is going to sell smartphone using its own OLED panel; Unigroup Guoxin expects to push DDR4 to the market by end of 2018; etc. 2018-08-02 老年 Uncategorised
07-31: Xiaomi and OPPO are aiming to launch their own versions as early as 2019; Samsung is reportedly planning to give its next Galaxy A series device a triple-camera and an in-display fingerprint sensor; etc. 2018-07-31 老年 Uncategorised
07-29: IC foundries have seen their 8” fabs run at full utilization; The recent ramp capacity of Chinese vendors could lead to oversupply for the memory in 2019; etc. 2018-07-29 老年 Uncategorised
07-27: Apple likely will not use its cellular modems in the next iPhone; Huawei is planning to roll out the first foldable handset with a flexible screen ahead of its bigger rival Samsung; etc. 2018-07-27 老年 Uncategorised
07-25: Qualcomm is announcing the final version of their mmWave antenna module; Sony has announced the upcoming release of the IMX586; etc. 2018-07-25 老年 Uncategorised