04-09: Samsung has reportedly decided to drop the J series of phones and merge it with the A series; BOE has revealed that the price of foldable smartphones will drop to around CNY10,000 by 2021; etc. 2019-04-09 老年 Uncategorised
04-08: Huawei leads the tri-cam market segment with more than 100M units shipped by 2020; China accounts for about 40% of the annual global DRAM market; etc. 2019-04-08 老年 Uncategorised
04-07: Samsung has announced that the modem is hitting mass production along with the single-chip radio frequency transceiver; Foxconn Technology Group is reportedly within weeks of starting trial production of the latest iPhones in India; etc. 2019-04-07 老年 Uncategorised
04-04: TSMC has announced delivery of the complete version of its 5nm design infrastructure; Xiaomi has restructured its semiconductor business Songguo Electronics; etc. 2019-04-04 老年 Uncategorised
04-02: Half of Huawei’s flagship offerings could sport foldable displays by 2021; Transsion Holdings has reportedly applied for listing on The Shanghai Stock Exchange; etc. 2019-04-02 老年 Uncategorised
03-31: SK Hynix will start production in Wuxi with a total investment of USD8.6B in DRAM memory in April 2019; Sony smartphone workforce will be reduced to half of the 4,000 people that are employed there now; etc. 2019-03-31 老年 Uncategorised
03-28: YMTC is set to kick off volume production of 64-layer 3D NAND flash chips by the end of 2019; Sony will close its smartphone plant in Beijing; etc. 2019-03-28 老年 Uncategorised
03-27: Huawei has reportedly deepened its deployments in related multimedia chips; Huawei has announced the construction of a chip factory in Cambridge, UK; etc. 2019-03-27 老年 Uncategorised
03-24: Summary of a series of reports – Pacific Securities, Guosheng Securities, Credit Suisse, UBS, TF Securities, etc. 2019-03-24 老年 Uncategorised
03-23: Huawei is reportedly to launch TVs in Apr 2019; Xiaomi is reportedly working on Android One phones with under display fingerprint scanners; etc. 2019-03-23 老年 Uncategorised
03-21: Qualcomm is introducing a new series of chips, QCS400 SoC series; Royole has said that it has begun shipping its first foldable smartphone; etc. 2019-03-21 老年 Uncategorised
03-19: Huawei will reportedly accelerate the R&D and mass production of its in-house chips; Xiaomi is investing INR3,500 crore into its Indian business unit; etc. 2019-03-19 老年 Uncategorised