IF / News – Page 2 – Daily News / Weekly Summary / Regular Discussion

8-27 #AntiSocial : Xiaomi is allegedly developing a tri-foldable phone; Samsung has confirmed that it is working on a “double-foldable” phone; OnePlus, OPPO, and realme have allegedly started developing an ecosystem of phone accessories with magnets; etc.

Huawei was first included in the United States’ export control list in 2019, but several companies including Qualcomm were allowed to export certain 4G chips to it after obtaining exemptions from Washington. Before being blacklisted from trade, Huawei had been… Read more ›

8-3 #Run : Apple’s both foldable devices will allegedly be coming in 2026; Meizu wants to launch its first electric car within 2024; The EU’s AI law officially enters into force on 1 Aug 2024; etc.

Applied Materials was rejected for funding under the CHIPS act for a research and development center in Silicon Valley. Commerce Department officials allegedly rejected the chipmaking equipment maker’s bid to gain U.S. funding for a USD4B facility in Sunnyvale, California.… Read more ›

8-1 #JustRun : SK hynix has announced the development of its GDDR7; Apple to bolster its manufacturing presence in India; vivo has officially announced that it will launch a MR headset in 2025; etc.

Qualcomm has formally announced its new Snapdragon 4s Gen 2 chipset (SM4635). At its core the Snapdragon 4s Gen 2 features 2x Cortex-A78 cores clocked at 2.0GHz and 6x Crotex-A55 at 1.8GHz. All eight cores are downclocked by 200 MHz… Read more ›

7-28 #CaughtCold : MediaTek has filed a lawsuit against Huawei; Apple’s foldable concept allegedly “has moved beyond the conceptual stage”; Huawei’s tri-fold phone is expected to be released in 4Q24; etc.

Samsung Electronics will reportedly use MediaTek’s high-end application processor (AP) Dimensity 9300+ instead of Qualcomm’s Snapdragon chipsets for its new premium tablet Galaxy Tab S10 to be unveiled as early as Oct 2024. It will mark the first time for… Read more ›

7-20 #Vulnerable : Qualcomm is suing Transsion; Huawei is suing MediaTek; OPPO and Ericsson have officially entered a global strategic partnership; etc.

Intel, AMD, Samsung, LG Innotek, and SKC’s US subsidiary Absolics have all highly focused on glass substrate technology for advanced packaging. Intel stated that glass substrates could lay the foundation for achieving an astounding one trillion transistors on a single… Read more ›

7-13 #StarePinch : Google’s Tensor G4 might be the last SoC to be made by Samsung Foundry; Huawei’s triple-foldable smartphone will allegedly adopt a dual-hinge design; Huawei is t adopt under-display 3D face recognition; etc.

Google’s Tensor G4 might be the last SoC that is mass produced by Samsung Foundry, as the Tensor G5 is said to leverage TSMC’s cutting-edge 3nm process when it powers the upcoming Pixel 10 series in late 2025. Since Samsung’s… Read more ›

7-8 #PainPoints : Samsung is developing a new chip package technology; JDI has unveiled a 4K x 4K IPS LCD micro-display; EU requires every portable device to have batteries that are easy to remove and replace by consumers or independent operators by 2027; etc.

Samsung is developing a new chip package technology to prevent overheating in application processors (AP). The package attaches a heat path block, or HPB, on top of the SoC, and is expected to be used on future Exynos chips, sources… Read more ›

6-30 #Partnership : Samsung is allegedly to adopt MediaTek’s SoC on its S25 series; Apple is exploring a new technology that will make it easier for people to remove the battery; Audi is bringing ChatGPT integration to its Audi models; etc.

According to Chris Patrick, SVP and General Manager of Handsets at Qualcomm, the company has been working on making Android version updates and security updates easier for quite a while. One of the things they been working on for the… Read more ›

6-27 #SteamDeck : Huawei is reportedly building a massive semiconductor equipment R&D center in Shanghai; Apple has allegedly renewed efforts to develop AR-only glasses; Honor has showcased some of its latest AI innovations; etc.

Huawei Technologies is reportedly building a massive semiconductor equipment research and development center in Shanghai. The center’s mission includes building lithography machines, vital equipment for producing cutting-edge chips. Total investment for the the entire R&D base will come to about… Read more ›

6-22 #Cheer : Samsung has reportedly decided to invest in GPUs; Royole has been declared bankrupt; Apple has allegedly suspended work on the second-generation Vision Pro; etc.

Samsung Electronics’ semiconductor chip factory in Taylor, Texas, USA, reportedly will not be operational until 2026. The company had announced its plans to invest USD17B to set up this chip factory, but it had to invest more as construction costs… Read more ›

6-18 #WorkTogether : Samsung is to release a next-gen flagship SoC feat its own GPU in 2026; Elon Musk believes smartphone will be replaced by the Neuralink neural interface; Tata Group is allegedly to acquire a majority stake in the Indian unit of vivo; etc.

The National Institute of Advanced Industrial Science and Technology (AIST) in Japan and IBM aim to develop a quantum computer with 10,000 quantum bits (qubits), which is 75 times the capacity of current quantum computers. In quantum computing, qubits are… Read more ›

6-15 #GoodARGlasses : Samsung Foundry has unveiled its new roadmap for chipmaking process technologies; Samsung has demonstrated its color e-paper display; Apple is expanding the capabilities of its satellite messaging on the iPhone; etc.

Samsung Foundry has unveiled its new roadmap for chipmaking process technologies outlining plans for 2nm-class nodes, a 1.4nm-class node. In 2025, Samsung will launch its SF2 node, previously known as SF3P, which demonstrated power, performance, and area (PPA) which the… Read more ›

6-12 #Putitdown : Apple’s series of announcements including Apple Intelligence; MediaTek is allegedly developing an Arm-based personal computer chip for Windows; Apple’s 7.9” foldable device is expected in 2026; etc.

Qualcomm has launched the Snapdragon 6s Gen 3 SoC. It is available in a 4G (SM-6370) and a 5G (SM6375-AC) variant. The Snapdragon 6s Gen 3 is based on a 6nm TSMC node. It has two CPU clusters: one with… Read more ›

6-7 #Rain : OPPO is committed to “making AI phones accessible to everyone”; Samsung has pre-emptively filed its own suit against Oura; Apple has allegedly tapped Samsung Display and LG Display to develop foldable display; etc.

Tsinghua University’s Department of Precision Instruments has unveiled a new computer chip inspired by the human brain that they say could revolutionize artificial intelligence applications like self-driving cars and smartphones. Tianmoc chip tackles a key challenge for AI: visual perception… Read more ›

6-2 #HeKnows : TSMC has scheduled its N3P node to enter mass production in 2H24; Samsung will allegedly implement a thicker UTG on new Flip; T-Mobile is buying U.S. Cellular’s wireless operations and certain spectrum assets; etc.

MediaTek has announced two new midrange chips – the Dimensity 7300 and Dimensity 7300X. Both the MediaTek Dimensity 7300 and Dimensity 7300X are fabricated on a 4nm process node and offer an octa-core CPU. It consists of 4 x Cortex-A78… Read more ›

5-26 #Future : Samsung has already started the development of a 2nm chipset; Samsung Display is reportedly collaborating with Lenovo to develop slidable display devices; TCL has unveiled the world’s first 7.85” tri-foldable smartphone; etc.

Samsung Electronics has already started the development of a 2nm chipset as competition with Apple and TSMC heats up. Samsung has said it would mass-produce the 2nm process for mobile applications in 2025. The process is claimed to showcase a… Read more ›