The DeepSeek R1 LLM (large-language model) was trained on Nvidia H100 but uses an Huawei Ascend 910C chip for inference, which is the action of using the trained model to generate responses. However, the Ascend 910C’s relatively lower performance limits… Read more ›
Samsung Electronics has announced a significant reduction in its foundry division’s facility investment for 2025, cutting the budget by more than half compared to the previous year. Samsung Foundry has set its facility investment budget at around KRW5T for 2025,… Read more ›
Taiwan Semiconductor Manufacturing Company (TSMC) has begun producing advanced 4nm chips for U.S. customers in Arizona, according to Commerce Secretary Gina Raimondo. In Nov 2024, Commerce finalized a USD6.6B grant to TSMC’s U.S. unit for semiconductor production in Phoenix, Arizona.… Read more ›
Taiwan Semiconductor Manufacturing Company (TSMC) is stepping up its efforts to expand its CoWoS (Chip on Wafer on Substrate) advanced packaging capacity with plans to double its monthly capacity to 75,000 wafers by 2025. This ambitious objective comes amid heightened… Read more ›
Nvidia is leaning into robotics as it looks to expand beyond its dominant AI chip business. The company plans to launch Jetson Thor, a new compact computer designed for humanoid robots, in 1H25. Deepu Talla, Nvidia’s vice president of robotics,… Read more ›
TSMC’s Arizona facility is reportedly set to initiate mass production of the 4nm process by 2H25, with clients such as Apple, NVIDIA, AMD, and Qualcomm being the primary beneficiaries. TSMC’s 4nm process will be under production at the Arizona facility… Read more ›
The US government plans to blacklist a Chinese company whose TSMC-made chip was illegally incorporated into a Huawei artificial-intelligence processor. The Chinese company, Sophgo, drew attention after a chip found on Huawei’s Ascend 910B multi-chip system matched one it ordered… Read more ›
Apple is reportedly switching over to a new Bluetooth and Wi-Fi chip that it designed in-house starting in 2025. The combined Bluetooth and Wi-Fi chip will replace components from Broadcom, allowing Apple to reduce its reliance on the company. The… Read more ›
Qualcomm could increase the price of the 2025 flagship chip by a “significant” amount. The chip has been dubbed the Snapdragon 8 Elite “Gen 2”, with the report alleging that “various internal and external factors” are the situation’s primary catalyst.… Read more ›
Samsung is expected to launch Galaxy S25 series in early 2025 and the Galaxy Z Fold 7 and Galaxy Z Flip 7 in 2H25. There are also Galaxy Z Fold 7 Special Edition and a Galaxy Z Flip FE. The… Read more ›
AMD and the Lawrence Livermore National Laboratory (LLNL) announced that the AMD-powered El Capitan has taken the top spot on the semi-annual Top500 list as the fastest-known supercomputer on the planet with 1.742 exaflops of performance. El Capitan debuts on… Read more ›
Tim Millet, vice president of Platform Architecture (Hardware Technologies) at Apple, is clear about what differentiates the company’s silicon strategy and why it can outperform the competition continuously. Tom Boger, Vice President of Mac Product Marketing at Apple, has underlined… Read more ›
Samsung is allegedly considering outsourcing Exynos chip manufacturing to TSMC. Samsung Galaxy S25 series will reportedly use Qualcomm Snapdragon 8 Elite chip worldwide. Apparently, solving the low yield issues of the company’s 3nm GAA wafers will take longer than it… Read more ›
TSMC will start producing 2nm GAA-based wafers in 4Q25 at its Fab 20 in Hsinchu which has a capacity of 30k wpm and will be followed by the 30k wpm Fab 22 in Kaohsiung which is expected to start produxtion… Read more ›
According to the “Mid-Year Total Semiconductor Equipment Forecast Report” released by SEMI in Jul 2024, global wafer fab equipment spending will increase from USD95.6B in 2023 to USD98.3B in 2024, a year-on-year increase of 3%, mainly due to the gradual… Read more ›
Intel is aiming to ship 100M units of AI PC, what it calls computers powered by its AI processors, by 2025, a 150% jump from its goal by 2025 of 40M units. Intel Sales & Marketing Group Director Jack Huang… Read more ›