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6-7 #Future : TSMC has reportedly initiated preparatory work for 2nm trial production; Xiaomi is allegedly working on a clamshell foldable phone; The authorized distributor for vivo in Poland is pulling out of the country; etc.

Cybersecurity experts at Dr. Web have discovered a new strain of spyware, dubbed “SpinOk,” in more than 100 Android apps. The spyware, which is disguised as an advertising software development kit (SDK), has been downloaded over 400M times from the Read more ›

6-3 #MorePraises : Qualcomm may exclusively use TSMC’s N3E for 8 Gen 4; Qualcomm reportedly discusses with Nintendo and Sony to develop hardware; Dixon Technologies is partnering with Xiaomi’s Indian; etc.

Tenstorrent and LG Electronics have announced that they are collaborating to build a new generation of RISC-V, AI, and video codec chiplets to potentially power LG’s premium TV and automotive products of the future and Tenstorrent’s data center products. Through Read more ›

5-26 #HotCoffee : Arm is seeking to raise prices for its chip designs; Sony is allegedly working on its first clamshell foldable smartphone; China has said Micron’s product has failed its network security review; etc.

Apple has announced a new multiyear, multibillion-dollar agreement with Broadcom. Through this collaboration, Broadcom will develop 5G radio frequency components — including FBAR filters — and cutting-edge wireless connectivity components. A Film Bulk Acoustic Resonator (FBAR) filter is a bulk Read more ›

5-21 #SummerHeat : Seven largest semiconductor makers have set out plans to increase manufacturing and deepen tech partnerships in Japan; Canon is allegedly looking to partner up with a smartphone maker; Samsung has notified its distributors that it will no longer sell DRAM chips below the current price; etc.

Seven of the world’s largest semiconductor makers have set out plans to increase manufacturing and deepen tech partnerships in Japan as western allies step up efforts to reshape the global chip supply chain amid rising tensions with China. Micron said Read more ›

5-14 #HaveOurBacks : OPPO may be forced to cease all operations and pull out of France; OPPO is shutting down its ZEKU chip unit; Samsung plans its next few gen of S Ultra to use 200Mp; etc.

OPPO is allegedly shutting down its ZEKU chip unit, which made MariSilicon chips. ZEKU covers product lines including core application processors, short-distance communication, 5G Modem, radio frequency, ISP and power management chips, etc. Founded in 2019, ZEKU focuses on providing Read more ›

5-7 #OfftheGrid : Honda Motor collaborates TSMC to ensure a “stable” supply of chips; iPhone 15 Pro models will no longer feature solid-state buttons; Tesla has begun producing the Model Y SUV with a Blade battery from BYD; etc.

Global semiconductor revenue is projected to decline 11.2% in 2023, according to the latest forecast from Gartner. In 2022, the market totaled USD599.6B, which was marginal growth of 0.2% from 2021. The short-term outlook for the semiconductor market has deteriorated Read more ›

5-4 #BetterTomorrow : Samsung is expected to increase its spending to raise wafer input for R&D; TSMC’s Arizona wafer cost may be 20-30% higher; JOLED has filed for bankruptcy protection; etc.

Samsung is expected to increase its spending to raise wafer input for research and development. Kyung Kye-hyun, Samsung’s Device Solutions Division CEO overseeing global memory operations, System LSI, has said the company will increase its wafer input to “gain the Read more ›

4-30 #Happy5-1 : Qualcomm is allegedly considering a dual-sourcing strategy for future high-end chipsets; Bosch is expanding its semiconductor business with silicon carbide chips; General Motors and Samsung SDI to build a new battery cell manufacturing plant in the US; etc.

German security company Nitrokey has recently released a report claiming that it has discovered an unrecorded feature in Qualcomm Snapdragon chips that collects and transmits user information directly to Qualcomm servers. Nitrokey installed a Google-free version of Android on a Read more ›

4-29 #BFF : Arm will team up with manufacturing partners to develop the new semiconductor; Samsung is allegedly planning to bring back Exynos SoCs to its S series; Apple will reportedly start using microLED panels as early as 2024; etc.

Arm is reportedly building its own semiconductor to showcase the capabilities of its products, as it seeks to attract new customers and fuel growth following its Initial Public Offering (IPO) later in 2023. Arm will team up with manufacturing partners Read more ›

4-15 #BadFlu : Intel has partnered with Arm to build low-power compute SoCs; vivo may be stopped from selling phones in Germany; Samsung’s first foldable tablet to be launched this year; etc.

Intel has revealed that Intel Foundry Services (IFS) has partnered with Arm to build low-power compute SoCs on the Intel 18A process. The Intel 18A process is a plan to introduce five increasingly advanced semiconductor manufacturing process technologies in five Read more ›

4-9 #HappyEaster : Samsung Z Flip5 will allegedly feature a bigger cover display; Samsung has announced that it will reduce its chip production; Huawei founder Ren Zhengfei has said “Huawei or HUAWEI” words cannot be used by any vehicle publicity or design; etc.

A new report from SellCell examines the latest handsets from all three companies, which include the lineups for the iPhone 14, Samsung S23, and Google’s Pixel 7 devices. The current iPhone series continued to hold its value the best, with Read more ›