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8-3 #NoFear : Huawei is not launching a 5G smartphone in Oct; Apple and Google are both reportedly considering entering the foldable tablet market; vivo has partner with Sony’s Lytia for a customized of CIS; etc.

TSMC Chairman Mark Liu has announced that the new global R&D center in Hsinchu, Taiwan, aims to explore cutting-edge chip technologies below 2nm or even 1.4nm process in the next 20 years. TSMC CEO CC Wei also attended the inauguration… Read more ›

7-30 #ThinkofLovedOnes : Samsung is confident the shipments of its foldables are on track to outsell the Galaxy Note in 2023; Samsung will continue to reduce semiconductor output during 2H23; Samsung’s Galaxy Ring could enter mass production as early as Aug 2023; etc.

Intel has unveiled its new ambitious plans to incorporate artificial intelligence (AI) into every product it creates. Intel CEO Pat Geslinger has stated that the company would take a more comprehensive approach, with the expectation that AI will eventually become… Read more ›

7-27 #Appreciation : A new Galaxy FE smartphone will launch soon; India has asked Xiaomi, OPPO, vivo to pay unpaid tax dues; India has rejected BYD’s proposal to set up a USD1B factory in India; etc.

Barclays analysts Blayne Curtis and Tom O’Malley believe that Apple is no longer planning to launch a fourth-generation iPhone SE in 2024. The analysts said the device was expected to feature an Apple-designed 5G modem, but the plans appear to… Read more ›

7-22 #BurnOut : Apple is allegedly running into difficulties with iPhone 15 big display manufacturing; Apple iPhone 16 Pro Max will allegedly feature a “Super Telephoto” periscope zoom camera; Apple’s iPhone 15 lineup will reportedly feature stacked battery technology; etc.

Qualcomm Technologies and Meta are working to optimize the execution of Meta’s Llama 2 large language models directly on-device – without relying on the sole use of cloud services. Qualcomm is scheduled to make available Llama 2-based AI implementations on… Read more ›

7-18 #OffTheGrid : ASML is facing tighter restrictions on its ability to work with Chinese customers; TSMC has changed its Kaohsiung plant construction plan to 2nm process; Xiaomi is to boosting sales through official retail stores in India; etc.

South Korean AI startup Rebellions wants to launch alternatives to AI chips offered by market leader Nvidia. Rebellions CEO Park Sunghyun said the startup’s goal is to, within 1-2 years, find specific applications that it can offer AI chips that… Read more ›

7-16 #UselessIdiot : The EU Council has adopted a new regulation that “strengthens sustainability rules for batteries”; China has announced export restrictions on two metals, gallium and germanium; Huawei’s licensing fee caps for 4G and 5G mobile phones are USD1.5 and USD2.5 per unit, respectively; etc.

Intel Foundry Services has introduced a broad range of tools for customers of its new 16nm-class process technology called Intel 16 that addresses mobile, RF, IoT, consumer, storage, military, aerospace, and government applications. The new technology complements Intel’s 22nm FFL… Read more ›

7-13 #Rage : Foxconn has withdrawn from a semiconductor JV with Vedanta; Huawei is reportedly plotting a return to the 5G smartphone industry by the end of 2023; Micron Technology has inked a pact with the Gujarat government for setting up a semiconductor manufacturing facility; etc.

Samsung Electronics has laid out its road map to expand its chip manufacturing business, including leading-edge semiconductors, as it looks to catch up with leader Taiwan Semiconductor Manufacturing Co (TSMC). Samsung said it will begin mass production of the 2nm… Read more ›

6-23 #DragonBoat : Qualcomm has announced significant job cuts; Intel will spend USD25B on a new factory in Israel; BOE, CSOT, Tianma, and Visionox have teamed up and filed a trial for patent invalidation of Samsung; etc.

Qualcomm has announced significant job cuts as it aims to reduce expenses in light of a persistent slowdown in smartphone sales. As per the Worker Adjustment and Retraining Notification Act (WARN) paperwork, the company has not only eliminated 415 positions… Read more ›

6-18 #Appreciation : Intel plans to invest up to USD4.6B in Poland; Huawei could launch a more affordable foldable phone in the near future; Micron plans to invest over CNY4.3B in its packaging and testing factory located in Xi’an city; etc.

SoftBank’s Arm is allegedly in talks with some of its biggest customers and end users about bringing on one or more anchor investors in the chip designer’s initial public offering (IPO). Arm is talking to at least 10 companies, including… Read more ›

6-15 #Aging : Enforcement Directorate (ED) has issued show-cause notices to Xiaomi India; Vodafone and CK Hutchison are planning to merge their UK businesses; Google apps have reportedly been “optimized” for Samsung’s new Flip; etc.

According to a lawsuit filed back in Nov 2022, Apple and Amazon allegedly joined forces to artificially inflate the prices of iPhones and iPads sold on the platform, effectively eliminating over 98% of all Apple resellers. Now, in a recent… Read more ›

6-10 #Driving : TSMC’s 3nm process is currently quoted at USD19,865 per wafer; TSMC is planning price rises for its chip fabs as soon as Jan 2024; Samsung plans to increase the price of NAND wafers; etc.

Qualcomm Snapdragon 8 Gen 2 and Apple A16 Bionic are mass produced on TSMC’s N4 (4nm) process. The Snapdragon 8 Gen 2 is allegedly priced higher than what Qualcomm’s clientele would like to pay because, for USD160, flagship smartphone makers… Read more ›

6-7 #Future : TSMC has reportedly initiated preparatory work for 2nm trial production; Xiaomi is allegedly working on a clamshell foldable phone; The authorized distributor for vivo in Poland is pulling out of the country; etc.

Cybersecurity experts at Dr. Web have discovered a new strain of spyware, dubbed “SpinOk,” in more than 100 Android apps. The spyware, which is disguised as an advertising software development kit (SDK), has been downloaded over 400M times from the… Read more ›

6-3 #MorePraises : Qualcomm may exclusively use TSMC’s N3E for 8 Gen 4; Qualcomm reportedly discusses with Nintendo and Sony to develop hardware; Dixon Technologies is partnering with Xiaomi’s Indian; etc.

Tenstorrent and LG Electronics have announced that they are collaborating to build a new generation of RISC-V, AI, and video codec chiplets to potentially power LG’s premium TV and automotive products of the future and Tenstorrent’s data center products. Through… Read more ›

5-31 #TooOld : Samsung is developing XR processor chips; Nvidia and MediaTek have said they will collaborate; realme may discontinue its sub-brand DIZO; etc.

Apple has recently filed a trademark for “SignChat” to provide sign language services. SignChat is a new accessibility service that provides info related to sign language. It is designed to help people who are deaf or hard of hearing to… Read more ›

5-28 #Old : MediaTek will form an alliance with Nvidia; TSMC is in talks with German authorities for up to 50% subsidies; Sony has announced its plan to acquire a land in Kumamoto Prefecture; etc.

MediaTek will form an alliance with Nvidia and announce related cooperation such as Windows on Arm PC chips. Through this cooperation, Nvidia will return to the Arm-based PC market and the long-coveted mobile phone chip market, and MediaTek will also… Read more ›

5-26 #HotCoffee : Arm is seeking to raise prices for its chip designs; Sony is allegedly working on its first clamshell foldable smartphone; China has said Micron’s product has failed its network security review; etc.

Apple has announced a new multiyear, multibillion-dollar agreement with Broadcom. Through this collaboration, Broadcom will develop 5G radio frequency components — including FBAR filters — and cutting-edge wireless connectivity components. A Film Bulk Acoustic Resonator (FBAR) filter is a bulk… Read more ›