November 2016 – Page 2 – IF / News

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11-14: Alibaba Group processing CNY120.7B worth of sales for 2016 Singles’ Day sales; JD.com has disclosed that total sales of 3C products made from the shopping event exceeded 42.5M on the Singles’ Day; etc.

Chipset Apple has replaced the legacy USB ports with Thunderbolt 3 ports. TheThunderbolt 3 capability inside of the entry-level 13” MacBook Pro is provided by an Intel JHL6540 Thunderbolt 3 controller. Former Intel PC chief Kirk Skaugen has indicated that Intel… Read more ›

11-11 Week: It is another week fill with tons of information, let’s quickly review and move on to another week—LeEco incidents, all sorts of flexible / full-display info, etc.

It is another week fill with tons of information, let’s quickly review and move on to another week— Headlines: LeEco incidents—LeEco CEO Jia Yueting admitted the holding company has been expanding too fast, and requires reflection; LeEco denied the news… Read more ›

11-12: Qualcomm Snapdragon 830 chipset will reportedly support QC4.0; Apple will allegedly release new 5” and 5.8” iPhones with curved, bezel-free designs in 2017; etc.

Chipset Qualcomm Snapdragon 830 chipset will reportedly support fast charging speeds of up to 28W, thanks to the Quick Charge 4.0 technology. Reportedly, the new charger will support configurations of up to 5V/4.7A~5.6A, 9V/4A. (CN Beta, Phone Arena, Fudzilla, Android… Read more ›

11-11: Samsung is being cautious about the rollout of its foldable smartphone as it closely gauges market demand; JDI announced it is cutting 4,700 jobs; JDI is to receive a bailout amount of about JPY75B from INCJ; etc.

Chipset Intel reportedly is planning to add USB 3.1 and Wi-Fi functions into its motherboard chipsets and the new design may be implemented in its upcoming 300-series scheduled to be released at the end of 2017. (Digitimes, press, OfWeek, My… Read more ›

11-10: Samsung and LG reportedly plan to launch foldable smartphones in 2017; JDI has revealed Full Active panel technology roadmap including flexible in 2019; etc.

Chipset According to SEMI Silicon Manufacturers Group (SMG), total silicon wafer area shipments were 2,730M-sq.inches during 3Q16, a 0.9% increase from the 2,706M-sq.inches shipped during 2Q16. New quarterly total area shipments are 5.4% higher than 3Q15 shipments and are at… Read more ›

11-9: LeEco allegedly owed 18 corps, in total CNY4.5B; Moto rumored will be the only one phone brand for Lenovo in the future; etc.

Chipset Taiwan Semiconductor Manufacturing Company (TSMC) winning sole supplier status for Apple’s A10 chip has seen the company’s revenue in 2016 to surge 32%. TSMC currently has a current market value of USD156B and accounts for 16% of Taiwan’s entire… Read more ›

11-8: Samsung will reportedly integrate 3-coil wireless charging on Galaxy S8, remove its Home button, and using Qualcomm ultrasonic fingerprint solution; etc.

Chipset Executive chairman and chairman of the board of Qualcomm Incorporated predicts that in the coming 5 years, there will be 8B units of smartphones sold, hence, denying that people are worried that the mobile industry is saturated. Additionally, there… Read more ›

11-7: Lenovo announces 1M units of the Moto Z series has been sold worldwide; Apple has reportedly sought incentives from the government to set up a manufacturing unit in India; etc.

Touch Panel The jointly-developed LTPS panel of Hon Hai Precision (Foxconn) and Innolux has reportedly been validated by Apple’s iPhone in-cell certification. This indicates that in the future Hon Hai may become another iPhone in-cell panel supplier. Currently Hon Hai’s… Read more ›

2017 Smartphone Features Prediction

Simply listing several features that would be appealing in 2017.These features might still be niche in 2017, but it is believed it will ramp up in 2018 onward. Σintell estimates about 1.47B units of smartphone shipped in 2017 globally, with… Read more ›

11-6: Rumors of LeEco’s financial problem; LeEco CEO’s internal email admits the expansion is too fast; etc.

Chipset NXP Semiconductor, the world’s largest chip supplier to the automotive industry, expects efforts to make self-driving cars will lead to more consolidation in its sector, says the company’s automotive head Kurt Sievers. (CN Beta, Fortune, Reuters) Smartphones At the… Read more ›

11-5: Samsung claims 85% of Note 7 has been recalled in U.S.; 70% of revenues of MediaTek-invested Goodix is still from fingerprint chipset products; etc.

Chipset Vanguard International Semiconductor (VIS) expects to post revenues of between NTD6.35B~6.65B in 4Q16. Gross margin and operating margin for the quarter will be 32.5-34.5% and 21-23%, respectively, compared with 34.4% and 23.4% in the prior quarter. VIS is optimistic… Read more ›

11-4: Apple accounted for 103.6% of smartphone industry operating profits in 3Q16; Huawei’s Richard Yu indicates that the company wants to become the world’s 2nd largest smartphone maker in 2 years, beating Apple; etc.

Chipset Massive government investment in China’s semiconductor industry risks distorting the global market for integrated circuits, leading to damaging overcapacity and stifling innovation, U.S. Commerce Secretary Penny Pritzker warned. She sharply criticized a USD150B plan by the Chinese government to… Read more ›

11-4 Week: A series of financial report, a series of merger / acquisition, and a series of panel makers investment; etc.

2016 is coming to an end, but first take a look at this week summary: A series of financial reports— MediaTek consolidated operating income USD240.35M Qualcomm net income USD1.6B Innolux recorded net operating profit of USD122M Synaptics revenue from mobile… Read more ›

11-3: Allegedly there won’t be Lenovo-branded phone in the future, only MOTO and ZUK; Broadcom acaquires network gear maker Brocade; Qualcomm F4Q16 revenue is USD6.2B; etc.

Chipset Chipmaker Broadcom acaquires network gear maker Brocade Communications Systems for USD5.5M to expand its fiber channel and data storage businesses. (CN Beta, Reuters, TechCrunch, Fortune) Qualcomm reported that Q4 FY2016 revenue is USD6.2B, a 13% increase on-year. Net income… Read more ›

11-2: Samsung will invest more than USD1B by the mid of 2017 to increase AP production in its facilities in Austin; Samsung Display would roll out a full-screen display whose display area ratio reaches more than 90% in 2017; etc.

Chipset Foundry vendors including Intel, TSMC, Samsung, Globalfoundries are venturing into a battle of advancing their manufacturing process. (EE Trend, OfWeek) Intel, TSMC, and other chipmakers weigh extreme ultraviolet (EUV) lithography, which may be ready by 2018. The brightness of… Read more ›

11-1: ARM to launch new GPU; GlobalWafers acquiring SEMI is reviewed by CFIUS; BOE’s G6 flexible AMOLED fab in Mianyang; etc.

Chipset ARM introduces Mali-G51 GPU using the new Bifrost architecture built with Vulkan in mind, for devices in 2018. ARM also unveiled a new video processor, the Mali-V61, which supports HEVC h.265 with HDR/10-bit and scales up to 4K @… Read more ›