11-14: Alibaba Group processing CNY120.7B worth of sales for 2016 Singles’ Day sales; has disclosed that total sales of 3C products made from the shopping event exceeded 42.5M on the Singles’ Day; etc.

Chipset Apple has replaced the legacy USB ports with Thunderbolt 3 ports. TheThunderbolt 3 capability inside of the entry-level 13” MacBook Pro is provided by an Intel JHL6540 Thunderbolt 3 controller. Former Intel PC chief Kirk Skaugen has indicated that Intel Read more ›

11-11: Samsung is being cautious about the rollout of its foldable smartphone as it closely gauges market demand; JDI announced it is cutting 4,700 jobs; JDI is to receive a bailout amount of about JPY75B from INCJ; etc.

Chipset Intel reportedly is planning to add USB 3.1 and Wi-Fi functions into its motherboard chipsets and the new design may be implemented in its upcoming 300-series scheduled to be released at the end of 2017. (Digitimes, press, OfWeek, My Read more ›

11-7: Lenovo announces 1M units of the Moto Z series has been sold worldwide; Apple has reportedly sought incentives from the government to set up a manufacturing unit in India; etc.

Touch Panel The jointly-developed LTPS panel of Hon Hai Precision (Foxconn) and Innolux has reportedly been validated by Apple’s iPhone in-cell certification. This indicates that in the future Hon Hai may become another iPhone in-cell panel supplier. Currently Hon Hai’s Read more ›

11-4: Apple accounted for 103.6% of smartphone industry operating profits in 3Q16; Huawei’s Richard Yu indicates that the company wants to become the world’s 2nd largest smartphone maker in 2 years, beating Apple; etc.

Chipset Massive government investment in China’s semiconductor industry risks distorting the global market for integrated circuits, leading to damaging overcapacity and stifling innovation, U.S. Commerce Secretary Penny Pritzker warned. She sharply criticized a USD150B plan by the Chinese government to Read more ›

11-3: Allegedly there won’t be Lenovo-branded phone in the future, only MOTO and ZUK; Broadcom acaquires network gear maker Brocade; Qualcomm F4Q16 revenue is USD6.2B; etc.

Chipset Chipmaker Broadcom acaquires network gear maker Brocade Communications Systems for USD5.5M to expand its fiber channel and data storage businesses. (CN Beta, Reuters, TechCrunch, Fortune) Qualcomm reported that Q4 FY2016 revenue is USD6.2B, a 13% increase on-year. Net income Read more ›

11-2: Samsung will invest more than USD1B by the mid of 2017 to increase AP production in its facilities in Austin; Samsung Display would roll out a full-screen display whose display area ratio reaches more than 90% in 2017; etc.

Chipset Foundry vendors including Intel, TSMC, Samsung, Globalfoundries are venturing into a battle of advancing their manufacturing process. (EE Trend, OfWeek) Intel, TSMC, and other chipmakers weigh extreme ultraviolet (EUV) lithography, which may be ready by 2018. The brightness of Read more ›