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6-18 #WorkTogether : Samsung is to release a next-gen flagship SoC feat its own GPU in 2026; Elon Musk believes smartphone will be replaced by the Neuralink neural interface; Tata Group is allegedly to acquire a majority stake in the Indian unit of vivo; etc.

The National Institute of Advanced Industrial Science and Technology (AIST) in Japan and IBM aim to develop a quantum computer with 10,000 quantum bits (qubits), which is 75 times the capacity of current quantum computers. In quantum computing, qubits are… Read more ›

6-15 #GoodARGlasses : Samsung Foundry has unveiled its new roadmap for chipmaking process technologies; Samsung has demonstrated its color e-paper display; Apple is expanding the capabilities of its satellite messaging on the iPhone; etc.

Samsung Foundry has unveiled its new roadmap for chipmaking process technologies outlining plans for 2nm-class nodes, a 1.4nm-class node. In 2025, Samsung will launch its SF2 node, previously known as SF3P, which demonstrated power, performance, and area (PPA) which the… Read more ›

6-12 #Putitdown : Apple’s series of announcements including Apple Intelligence; MediaTek is allegedly developing an Arm-based personal computer chip for Windows; Apple’s 7.9” foldable device is expected in 2026; etc.

Qualcomm has launched the Snapdragon 6s Gen 3 SoC. It is available in a 4G (SM-6370) and a 5G (SM6375-AC) variant. The Snapdragon 6s Gen 3 is based on a 6nm TSMC node. It has two CPU clusters: one with… Read more ›

6-7 #Rain : OPPO is committed to “making AI phones accessible to everyone”; Samsung has pre-emptively filed its own suit against Oura; Apple has allegedly tapped Samsung Display and LG Display to develop foldable display; etc.

Tsinghua University’s Department of Precision Instruments has unveiled a new computer chip inspired by the human brain that they say could revolutionize artificial intelligence applications like self-driving cars and smartphones. Tianmoc chip tackles a key challenge for AI: visual perception… Read more ›

6-2 #HeKnows : TSMC has scheduled its N3P node to enter mass production in 2H24; Samsung will allegedly implement a thicker UTG on new Flip; T-Mobile is buying U.S. Cellular’s wireless operations and certain spectrum assets; etc.

MediaTek has announced two new midrange chips – the Dimensity 7300 and Dimensity 7300X. Both the MediaTek Dimensity 7300 and Dimensity 7300X are fabricated on a 4nm process node and offer an octa-core CPU. It consists of 4 x Cortex-A78… Read more ›

5-26 #Future : Samsung has already started the development of a 2nm chipset; Samsung Display is reportedly collaborating with Lenovo to develop slidable display devices; TCL has unveiled the world’s first 7.85” tri-foldable smartphone; etc.

Samsung Electronics has already started the development of a 2nm chipset as competition with Apple and TSMC heats up. Samsung has said it would mass-produce the 2nm process for mobile applications in 2025. The process is claimed to showcase a… Read more ›

5-11 #GoHome : Apple reportedly has struck an agreement with Samsung Display for foldable display; Apple has cut its 2024 Vision Pro shipments to 400K–450K units; Apple is studying the possibility of working with an electric vehicle (EV) startup company; etc.

Apple reportedly has been working on its own chip designed to run artificial-intelligence (AI) software in data-center servers. Project ACDC (Apple Chips in Data Center) has been in the works for several years. Apple’s server chip will likely be focused… Read more ›

5-5 #Embrace : Samsung is currently developing next-gen GAA technology; Two major international manufacturers in China have stopped updating their small foldable phone lines; Apple has allegedly renewed discussions with OpenAI; etc.

Samsung Electronics is currently developing next-generation “gate-all-around” (GAA) technology, aimed for application in the 2nm foundry processes it plans to mass produce in 2025. GAA technology is a next-generation transistor technology that regulates and amplifies or switches off the flow… Read more ›

5-1 #HappyLaborDay : TSMC has announced its “A16” will enter production in 2H26; Samsung Electronics is deepening ties with Zeiss Group; ASML will no longer service certain chipmaking equipment purchased by Chinese customers; etc.

Taiwan Semiconductor Manufacturing Co (TSMC) has announced that a new chip manufacturing technology called “A16” will enter production in 2H26. The announced 1.6nm process relies on gate-all-around nanosheet transistors, just like the upcoming N2, N2P and N2X architectures based on… Read more ›

4-26 #VIPs : vivo has unveiled “BlueImage” brand; Oura is aggressively expanding its retail footprint in the US; Meta has announced that the operating system Horizon OS; etc.

Qualcomm expands the Snapdragon X Series platform portfolio with Snapdragon X Plus. Snapdragon X Plus features the state-of-the-art Qualcomm Oryon CPU, a custom-integrated processor that delivers up to 37% faster CPU performance compared to competitors, while consuming up to 54%… Read more ›

4-13 #Gamer : Apple is allegedly focusing on foldable products; OPPO, OnePlus, and realme are reportedly working on the ultrasonic FoD; Huawei is reportedly building a giant R&D center near Shanghai; etc.

Intel and Altera have announced new AI-optimized processors and field programmable gate arrays (FPGAs) for edge computing. By introducing a range of edge-optimized Intel Core Ultra processors, Intel Core processors, and Intel Atom processors, alongside Agilex 5 FPGAs, the companies… Read more ›

4-5 #Qingming : TSMC has resumed work at its fabrication sites in Taiwan after an earthquake-led shutdown; Infinix is allegedly developing its first foldable smartphone; Google is allegedly considering charging for AI-powered search; etc.

Taiwan Semiconductor Manufacturing Company (TSMC) has resumed work at its fabrication sites in Taiwan after an earthquake-led shutdown. The company was able to recover quickly, with no damage to critical chipmaking equipment, ensuring minimal disruption to chip supply. Despite initial… Read more ›

4-1 #Turbulence : The demand for mature wafer foundry processes is weak; GigaDevice plans to participate in CXMT’s latest capital increase; Micron said that its HBM production capacity in 2024 has already been sold out; etc.

In the era of rapid AI advancements, the need for more computing power has become crucial for future progress. With that, we will witness a drastic increase in transistor counts in semiconductors, potentially reaching the 1T mark by the end… Read more ›

3-30 #BestInnovation : Intel has announced its new AI PC Developer Program; China Mobile has announced the commercial launch of 5G-Advanced; Apple and Tencent are reportedly to become partners; etc.

Qualcomm has announced S3 Gen 3 and S5 Gen 3 Sound platforms. The Qualcomm S3 Gen 3 Sound platform offers an unprecedented level of customization and flexibility to OEMs, via support for a wide range of 3rd party feature enhancements… Read more ›

3-23 #LetItGo : MediaTek and Nvidia collaborate on Dimensity Auto Cockpit platforms; Samsung’s memory semiconductor business is reportedly expected to recover in 2024; Samsung is “reviewing” bringing Galaxy AI features to the Galaxy S22 series; etc.

Samsung Electronics will supply its next-generation Mach-1 artificial intelligence chips to Naver by the end of 2024 in a deal worth up to KRW1T (USD752M). With the contract, Naver will significantly reduce its reliance on Nvidia for AI chips. Samsung… Read more ›

3-16 #Decade : MediaTek is now turning its focus to the fast-growing premium segment; SMIC is rumored to be assembling a team dedicated to 3nm chip development; Samsung is allegedly looking to bring back the squarish design for its smartwatches; etc.

According to Anku Jain, managing director, MediaTek India, MediaTek is now turning its focus to the fast-growing premium segment with its latest 5G chipsets, having attained a dominant 50% market share, outpacing rival Qualcomm in the highly competitive India smartphone… Read more ›