03-23: US President Donald Trump has signed an executive memorandum that would impose retaliatory tariffs on up to USD60B in Chinese imports; etc. 2018-03-23 老年 Uncategorised
03-22: Huawei revealed that “notch display” is only a phase; Most Android phones will have to wait until 2019 to duplicate the 3D sensing feature behind Apple’s Face ID security; etc. 2018-03-22 老年 Uncategorised
03-20: Broadcom now has 3 potential targets, namely MediaTek, Cirrus Logic and Xilinx; Huawei is likely to use Qi and AirFuel’s wireless charging technology in the future; etc. 2018-03-20 老年 Uncategorised
03-16 Week: Monday is always coming fast, let’s quickly have a look at last week. 2018-03-18 老年 Uncategorised
03-18: Samsung is geared up to launch India-focused smartphones across price points in the remaining part of 2018; Huawei is set to significantly ramp up handset production capacity at its Chennai factory; etc. 2018-03-18 老年 Uncategorised
03-16: Tobii has announced a collaboration with Qualcomm; Mantis Vision is reportedly working on developing 3D sensing camera solutions with Namuga; etc. 2018-03-16 老年 Uncategorised
03-15: Broadcom has announced that it will move its corporate headquarters back to the U.S; Tianma is aggressively pushing Wuhan Tianma Gen-6 LTPS mass production line; Samsung Electronics is reportedly planning to increase its production capacity of image sensors; etc. 2018-03-15 老年 Uncategorised
03-14: RIP Stephen Hawking… Broadcomm officially end the Qualcomm acquisition effort; vivo announces its new “Super HDR” platform; etc. 2018-03-14 老年 Uncategorised
03-13: Xiaomi reportedly plans to launch at least 6 smartphone models in India in 2018; President Trump has issued an order blocking Broadcom’s proposed takeover of Qualcomm; etc. 2018-03-13 老年 Uncategorised
03-02 Week: Intel bids on Broadcomm; Qualcomm’s quantum chip; ARM’s new products; Qualcomm negotiating with Huawei; etc. 2018-03-11 老年 Uncategorised
03-11: Intel allegedly considers bid for Broadcom; BOE has officially announced its plans to construct its third line in Chongqing’s Liangjiang New District; etc. 2018-03-11 老年 Uncategorised
03-10: Huawei Kirin 670 reportedly to equip with NPU; Qualcomm SD855 Fusion Platform is leaked; Samsung Galaxy Note 9 reportedly will not adopt under-display fingerprint; etc. 2018-03-10 老年 Uncategorised
03-07: Qualcomm is allegedly in talks to settle a dispute with Huawei Technologies; MediaTek and Tencent have announced a joint collaboration for an innovation lab; etc. 2018-03-07 老年 Uncategorised
03-06: Samsung’s OLED factory utilization rate is estimated to now be at 50%~60%; Xiaomi plans to enter US market by end of 2018, or by early 2019; etc. 2018-03-06 老年 Uncategorised