8-12 Week: This was a busy week, and let’s have a summary — Qualcomm and vivo, MediaTek Helio X30, UDC and Tianma for OLED, LeEco and Coolpad, etc.

It is another busy week, and let’s take a look at this week summary: Headlines: Qualcomm and vivo have entered into a new 3G and 4G Chinese Patent License Agreement Qualcomm claims to have licensing deals with more than 200 Chinese companies MediaTek introduces deca-core Helio X30 processor UDC has signed a 5-year OLED agreement…

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8-11: OPPO and vivo are aided by old-school brick-and-mortar stores and the kind of advertising blitz; JDI has announced a new display technology known as a “Full Active” panel; etc.

Chipset TSMC reportedly will replace Samsung as the sole supplier of chips for the new Apple Watch starting 2H16, using 16nm process technology, according to KGI Securities analyst  Ming-Chi Kuo. (Digitimes, press, EE Focus, Laoyaoba) Spreadtrum announces its WCDMA / HSPA(+) platform SC7731C will be adopted by Africa’s largest mobile operator MTN from 3Q16. Both…

8-9: Discovered 4 new vulnerabilities affecting over 900mln Android devices with Qualcomm chipset; Samsung controls about 99% of the global smartphone OLED market; etc.

Chipset Mobile researchers from Check Point Software Technologies announced 4 new vulnerabilities affecting over 900 million Android smartphones and tablets built using the Qualcomm chipset. (CN Beta, Channel News, Reseller, Check Point) Qualcomm announced that its subsidiary, Qualcomm Technologies, Inc. (QTI), is working closely with Baidu in the implementation of the Qualcomm IZat Integrated Hardware…

8-8: Qualcomm has entered into a new 3G and 4G Chinese Patent License Agreement with vivo; Samsung would make the edge display as the identity of the Galaxy S lineup; etc.

Chipset Qualcomm has announced that it has entered into a new 3G and 4G Chinese Patent License Agreement with vivo. Under the terms of the agreement, Qualcomm has granted vivo a royalty-bearing patent license to develop, manufacture and sell 3G WCDMA and CDMA2000 and 4G LTE (including “3-mode” GSM, TD-SCDMA and LTE-TDD) complete devices for…

8-7: LeEco’s Jia Yueting aims to sell 100 million units of LeEco + Coolpad smartphones in 2 years; has suggested that making consumer-ready foldable phones is not exactly possible; etc.

Touch Display Universal Display (UDC) signed a 5-year OLED Technology License Agreement and Supplemental Material Purchase Agreement with Tianma Micro-electronics. UDC grants Tianma non-exclusive license rights to manufacture and sell OLED display products based on its IPs. UDC also supplies phosphorescent OLED materials to Tianma. (OLED-Info, UDC, Sohu) Universal Display (UDC) reported its financial results…

8-5 Week: Another month has passed! This week summary we have Didi Chuxing and Uber, Tsinghua Unigroup and XMC, Qualcomm and OPPO, Samsung, Apple, etc.

Another month has passed. This week summary: Headlines – Didi Chuxing merges with Uber’s Chinese business unit Sony aims to launch flagship products only in India Gionee’s sub-brand IUNI has filed for bankruptcy Qualcomm and OPPO have entered into a new 3G and 4G patent license agreement for China MediaTek announced consolidated revenues of NTD72.53…

8-5: Gionee’s subrand IUNI files for bankruptcy; Xingfei Technology is acquiring Shenzhen Eastaeon Technology; etc.

Chipset IBM has created randomly spiking neurons using phase-change materials to store and process data. This demonstration marks a significant step forward in the development of energy-efficient, ultra-dense integrated neuromorphic technologies for applications in cognitive computing. (CN Beta, Phys, Computer World, Nature) IC Insights forecasts that in total, 2H16 semiconductor industry capital spending is expected…

8-4: MediaTek announced consolidated revenues of NTD72.53 billion; Samsung Galaxy Note 7 sales could reach 12 million for 2H16; etc.

Chipset MediaTek announced consolidated revenues of NTD72.53 billion (USD2.29 billion) for the 2Q16, up 29.7% sequentially and 54.2% on year. The company credited the positive performance to rising chip demand for smartphones and recognition of revenues from acquired companies such as Richtek Technology. (EEPW, TechNews, Digitimes, press) Thanks to China Mobile relaunch its subsidy program,…

LCD Information Sharing (201608 Updates)

This is a simple report consolidating the market information obtained in regards to LCD display for smartphones. It mainly discusses the display technology a-Si and LTPS. IDC expects global smartphone shipment to exceed 1.48B units, merely 3% growth on-year. 2016-2019 CAGR would be around 5.7%, and by 2019 the global shipment would reach 1.75B units. 5” and…

8-3: Windows Phone still has 2.79% market share; Samsung said it is assessing the 2-metal chip-on-film from LG Innotek; etc.

Chipset United Microelectronics (UMC) has verified on silicon its 0.18-micron Bipolar CMOS DMOS (BCD) process for the most stringent AEC Q100 grade-0 automotive chips. (OfWeek, EEPW, Digitimes, press) The board of TSMC has approved capital appropriations of approximately US$D.79 billion to expand capacity for advanced-node manufacturing, as well as converting certain logic capacity to specialty…

8-2: Didi Chuxing to merge with Uber’s Chinese business unit; Till end of June 2016, CNY2000 above mid-to-high end smartphone market share has increased 4.38% from 2015 to 47.59%; etc.

Chipset According to Digitimes, many wafer foundry houses in Taiwan and China are expected to join the race to ramp capacity after TSMC announced recently that it will raise its capex for 2016 to USD9.5-10.5 billion from USD9-10 billion set previously. (Digitimes, press, China Times) Intel has finally started up their 10nm fabrication facility and…

8-1: Qualcomm and OPPO have entered into a new 3G and 4G patent license agreement for China; Didi Chuxing is reportedly taking over Uber’s local business in China; China vendors have curved display smartphones for the market soon; etc.

Chipset Qualcomm and OPPO announced that that they have entered into a new 3G and 4G patent license agreement for China. Under the terms of the agreement, Qualcomm has granted OPPO a royalty bearing patent license to develop, manufacture and sell 3G (WCDMA and CDMA2000) and 4G, including 3-mode (LTE-TDD, TD-SCDMA and GSM) complete terminals….

7-29 Week: A busy week gone by, a new busy week coming. This week recap with 2Q16 smartphone shipment numbers, a few corporate financial reports, LeEco acquires Vizio; etc.

A busy week gone by, a new busy week coming. This week recap: Headlines–LeEco announced an agreement to buy American TV-maker Vizio; After more than 50 years of miniaturization, the transistor could stop shrinking in just 5 years; Analog Devices Inc. (ADI) will acquire rival Linear Technology Corp.; MediaTek Helio X30 will be manufactured by TSMC using 10nm…

7-31: Spreadtrum 4G chipset is used by Samsung new smartphone; Qualcomm Snapdragon 830 reportedly is manufactured with 10nm process; 2Q16 global tablet shipment reached 33.54mln units; etc.

Chipset According to SEMI, foundry capacity growth is forecast to outgrow the overall industry at about 5% each year to reach 6 million wafers per month (wpm) (200mm equivalent) by the end of 2017. Taiwan is the largest foundry capacity region and accounts for over 55% of 300mm foundry capacity in the world, led by…

7-30: A series of numbers — 2Q16 340mln smartphones shipped, Apple iPhone latest ASP USD595, Microsoft sold 13.8mln Lumia, etc.

Chipset TSMC, Samsung and Intel are competing aggressively on advanced manufacturing process node—after 14/16nm, now entering 10nm. Intel will be superior to TSMC and Samsung at 10nm as it was at 14nm, says Linley Gwennap of the Linley Group. TSMC’s emerging 10nm process leapfrogs Intel’s 14nm node, and TSMC is now moving at a faster…