11-26: Xiaomi indicates Xiaomi’s plummeting smartphone sales are of little concern to the company’s bottom line; Huawei indicates India is an important market; etc.

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11-16: Samsung might be contemplating selling refurbished Galaxy Note 7 units starting from 2017; Kryptowire has identified some Android mobile devices with firmware that collected user’s sensitive personal data and transmitted to third-party servers; etc.

Chipset Intel CEO Brian Krzanich announced that Intel Capital would be investing USD250M in autonomous driving over the next 2 years. (TechCrunch, The Verge, Intel, Tencent, iFeng) IC Insights released top-20 2016 semiconductor suppliers, which  includes 8 suppliers headquartered in the U.S., 3 in Japan, 3 in Taiwan, 3 in Europe, two in South Korea,…

11-15: Leshi Holdings has secured commitments for USD600M; LeEco-backed Faraday Future has reportedly stopped work on its USD1B factory in Nevada; etc.

Chipset Samsung reportedly plans on installing its latest Exynos 9 chipset that will include the so-called Shannon 359 modem into its upcoming devices. Shannon 359 will support just about all the network basebands in the market including FDD-LTE, TD-LTE, TD-SCDMA, WCDMA, CDMA2000, CDMA, and GSM. (CN Beta, Softpedia, Decca Chronicle, WCCF Tech) Nvidia CEO Jen-Hsun…

11-14: Alibaba Group processing CNY120.7B worth of sales for 2016 Singles’ Day sales; JD.com has disclosed that total sales of 3C products made from the shopping event exceeded 42.5M on the Singles’ Day; etc.

Chipset Apple has replaced the legacy USB ports with Thunderbolt 3 ports. TheThunderbolt 3 capability inside of the entry-level 13” MacBook Pro is provided by an Intel JHL6540 Thunderbolt 3 controller. Former Intel PC chief Kirk Skaugen has indicated that Intel has a history of intelligent integration, when Intel integrates they add a little bit to…

11-11 Week: It is another week fill with tons of information, let’s quickly review and move on to another week—LeEco incidents, all sorts of flexible / full-display info, etc.

It is another week fill with tons of information, let’s quickly review and move on to another week— Headlines: LeEco incidents—LeEco CEO Jia Yueting admitted the holding company has been expanding too fast, and requires reflection; LeEco denied the news of “LeEco owes suppliers more than CNY10B, and the said suppliers already stop supplying components…

11-12: Qualcomm Snapdragon 830 chipset will reportedly support QC4.0; Apple will allegedly release new 5” and 5.8” iPhones with curved, bezel-free designs in 2017; etc.

Chipset Qualcomm Snapdragon 830 chipset will reportedly support fast charging speeds of up to 28W, thanks to the Quick Charge 4.0 technology. Reportedly, the new charger will support configurations of up to 5V/4.7A~5.6A, 9V/4A. (CN Beta, Phone Arena, Fudzilla, Android Headlines) Nvidia has just released their financial results for the Q3 FY2017, ending 30 Oct….

11-11: Samsung is being cautious about the rollout of its foldable smartphone as it closely gauges market demand; JDI announced it is cutting 4,700 jobs; JDI is to receive a bailout amount of about JPY75B from INCJ; etc.

Chipset Intel reportedly is planning to add USB 3.1 and Wi-Fi functions into its motherboard chipsets and the new design may be implemented in its upcoming 300-series scheduled to be released at the end of 2017. (Digitimes, press, OfWeek, My Drivers) BlueFin Research Partners analysts Paul Peterson and Steve Mullane offer up their thoughts on…