9-20: MediaTek 4G chipsets reportedly will be in tight supply till 2017; In 2016 Spreadtrum’s 3G share is believed to exceed MediaTek in the market; etc.

Chipset ARM announces Cortex-R52, the company’s first implementation of ARMv8-R aiming for IoT and autonomous automotive applications. The Cortex-R52 offers a 35% performance uplift compared to the Cortex-R5. (CN Beta, 91, My Drivers, AnandTech, article, Venture Beat) Venkata Renduchintala, president of the Client and IoT Businesses and Systems Architecture Group at Intel indicates that Intel…

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9-19: MediaTek is considering launching Helio X35; Samsung is looking to invest heavily in its OLED business, which will squeeze capex on foundry; etc.

Chipset To expand its coverage of products, after launching its Helio X30 using TSMC’s 10nm process, which will enter mass production end of 2016 / beginning of 2017, MediaTek is considering to launch Helio X35. (HC360, Woyoo, ETime, Sohu) According to Digitimes, Samsung is looking to invest heavily in its OLED business, which will squeeze…

9-18: Indian manufacture slow and cycle is long, and tax is a huge factor; Xiaomi Mi4 is found out having a “backdoor”; etc.

Chipset According to a teardown of Apple iPhone 7 by Chipworks, A10 Fusion processor part number is APL1W24,339S00255. A10 is thin thanks to TSMC’s InFO packaging technology. Intel has four components: the baseband LTE modem, two transceivers and a power management chip. (CN Beta, Forbes, Patently Apple, Chipworks) Although volumes are still small, fully depleted…

9-16 Week: Happy Mid-Autumn, and this week we have Qualcomm SD653, Samsung Exynos 8895, Samsung invests in CSOT 11G fab, etc.

Happy Mid-Autumn Festival, and wish everyone a happy family. This week summary: Headlines: Qualcomm Snapdragon 653 (MSM8976Pro) chipset information is leaked Qualcomm has announced the opening of Qualcomm Communication Technologies (Shanghai) in Shanghai Qualcomm introduces new Clear Sight dual camera system Samsung Exynos 8895 leaks Samsung is apparently in talks with NVIDIA and AMD about…

9-16: Samsung Electronics has sold all its shares in Sharp; Blackcow Food raises CNY18 billion that will be invested in OLED R&D and production; etc.

Chipset Globalfoundries (GF) has announced plans for a 7nm FinFET process that can deliver chips with up to 30% more performance or 60% less power consumption than its current 14nm node. The process will be in production in late 2018. Separately, GF will support a new embedded MRAM in sub-Gbit densities starting in 2018 for…

9-15 Happy Mid-Autumn Festival: Apple announced that the first batch of iPhone 7 Plus has sold out globally; Qualcomm introduces new Clear Sight dual camera system; etc.

Chipset Samsung Exynos 8895 leaks – to reach frequencies of 3.0GHz and power consumption lower than 5W. (Phone Arena, WCCF Tech, ZOL, My Drivers) Chip orders for Apple iPhone 7 placed thus far for 2016 are higher than previously estimated, according to Digitimes. Apple has set a goal of having had its manufacturing partners make…

9-14: India urges tech giants to integrate biometric technology of Aadhaar program into their products; Alibaba’s payments arm, Ant Financial, has acquired EyeVerify; etc.

Chipset NVIDIA revealed a new configuration of its DRIVE PX 2 in-car autonomous driving computing platform. The new single-core configuration will be used by Baidu in its own self-driving cars. It makes it possible to process visual and sensor data from self-driving car-mounted monitoring systems in real-time on board a vehicle. (TechCrunch, NVIDIA, China Xiao…

9-13: Samsung Display to invest CNY210mln in CSOT’s G11 fab; South Korea’s earthquake do not impact much on semiconductor / panel makers; etc.

Chipset NVIDIA’s new Tesla P4 and P40 GPUs are targeted at deep learning. The P40 has 3,840 CUDA cores, offers 12 teraflops of single-precision performance, has 24GB of GDDR5 memory and draws 250W of power.  The P4 has 2,560 cores, delivers 5.5 teraflops of single-precision performance, has 8GB of GDDR5 memory, and draws up to…

9-10: China-based smartphone vendors have become more conservative about placing orders for parts and components 4Q16; Xiaomi, Lenovo, OPPO, vivo have occupied 18.3% market share of Tier 2&3 cities; etc.

Chipset Qualcomm Snapdragon 653 (MSM8976Pro) chipset information is leaked. It will be manufactured using the 28nm process, featuring octa-core—4×Cortex A73+4×Cortex A53. (Gizmo China, CN Beta) Taking advantage of technology developed to manipulate light on chips, a team based in Spain and Italy has created an integrated circuit that can be used to generate true random numbers by…

9-9 Week: It is another busy week, and let’s take a look at this week summary–Samsung battery problem, iPhone 7 launched, Xiaomi Foxconn new assembly fab in India, Apple Foxconn talks about manufacturing in India; etc.

It is another busy week, and let’s take a look at this week summary: Headlines: Samsung Galaxy Note 7 recall due to battery issue estimates costs Samsung around USD1 billion or less Apple reportedly has issued a request for quotation (RFQ) to MediaTek recently for wireless charging chips Apple and Foxconn to look at the…

9-9: MediaTek has reported consolidated revenues of USD827.9 million for August 2016; Facial recognition grows the fastest, and tech giants have already started development for a long time; etc.

Chipset MediaTek has reported consolidated revenues of NTD25.87 billion (USD827.9 million) for August 2016, up 4.2% sequentially and 36.1% on year. The monthly results were also a record high. MediaTek generated revenues of NT$72.53 billion in 2Q16 – a record high. (Phone Arena, TechNews, Digitimes, press) Samsung Electronics is selling EUR606 million (USD681 million) of…

9-7: Xiaomi and Foxconn to build a new smartphone assembly plant in India; Huawei has sold 6 million P6 worldwide since launched in April 2016; Intel acquires Movidius; etc.

Chipset Intel acquires computer vision startup Movidius to build up its RealSense platform. Movidius has seen a great deal of interest in its radically low-powered computer vision chipset, signing deals with major device makers, including Google, Lenovo and DJI. (Android Authority, TechCrunch, Intel, Movidius, Engadget, CN Beta) TSMC’s 7nm technology is scheduled to volume production…

9-6: Apple reportedly has issued a RFQ to MediaTek; BOE only has one G5 LCD production line, and it is still operating; An annual increase of 31.6% for 2017 total LTPS panel capacity; etc.

Chipset Apple reportedly has issued a request for quotation (RFQ) to MediaTek recently for wireless charging chips for an iPhone case. (163, Hexun, Phone Arena, Digtimes, press) SoftBank is announcing that the transaction is complete. The total acquisition price of ARM is approximately GBP24 billion (USD31 billion). (The Verge, Softbank, CN Beta) University of Wisconsin-Madison…

9-5: Estimate cost of 2.5 million Samsung Galaxy Note 7 recall due to battery issue at around USD1bln; CMOS image sensor suppliers should prioritize the 6 technologies; etc.

Chipset Silicon Valley is rethinking the circuit board, in a bet that flexible, form-fitting alternatives could reshape electronics and spur more manufacturing in the U.S. manufacturing specialists like Jabil Circuit and Flextronics International keep facilities in the U.S. to help customers design products and build prototypes. (CN Beta, ADVFN, NASDAQ, 4-Traders) Set-top box (STB) solution…