6-18 #TinySurprise: Nokia and Broadcom are collaborating on the development of advanced semiconductor technologies; Qualcomm has announced Snapdragon 690; O-Film has successfully developed the slimmest periscope continuous zoom module; etc. Posted on 2020-06-18 By 老年 Advertisements Advertisements
6-14 #PrayforGood: UMC has been ordered to pay a fine of NTD100M (USD3.36M) to Micron in Taiwan; Samsung has sold its smartphones at USD292 on average in 1Q20; etc. Posted on 2020-06-14 By 老年
6-12 #WeeklySummary: Visionox’s camera under display; BOE OLED fails Apple’s test; CSOT and Sanan Opto collaborates; etc. Posted on 2020-06-13 By 老年
6-13 #GratefulWeekends: Samsung has reportedly built a small 7nm production line that does not use U.S. equipment; OPPO is allegedly going to introduce SuperVOOC 3.0 with 80W rate; etc. Posted on 2020-06-13 By 老年
6-10 #BunkerBoy: UNISOC has announced that it has signed a strategic cooperation agreement with Hisense; BOE have allegedly failed to pass Samsung’s quality testing; Visionox has revealed the company is ready to begin mass production of displays with under-screen cameras; etc. Posted on 2020-06-10 By 老年
6-8 #RainingDays: Sanan Semiconductor and CSOT have jointly established a lab to develop Micro-LED technology; China Unicom and Huawei have signed a strategic cooperative agreement on low-orbit satellites and integration of 5G network technologies & solutions; etc. Posted on 2020-06-08 By 老年
6-5 #WeeklySummary: TSMC to delay 3nm trial; Apple to build Micro-LED factory in Taiwan; Huawei is to replace US equipments; etc. Posted on 2020-06-06 By 老年
6-6 #WorkComes1st: IDC expects worldwide smartphone market is forecast to decline 11.9% YoY in 2020 with shipments totaling 1.2B units; More than 13,500 phones manufactured by vivo were found to be running on the same IMEI in India; etc. Posted on 2020-06-06 By 老年
6-3 #SavingGrace: TSMC has had to delay its plans of 3nm until early 2021; Huawei is rumored currently in works to replace US equipment; Apple is reportedly investing USD330M in a new factory in Taiwan where it will build MicroLED displays; etc. Posted on 2020-06-03 By 老年
5-31 #Empathy: UNISOC is collaborating with Wanxiang Blockchain, aitos.io, Fibocom, initiating integration innovation of the Internet of Things + Blockchain; Samsung has announced Exynos 850; etc. Posted on 2020-05-31 By 老年
5-30 #WeeklySummary: Huawei has been busy, OPPO is hiring SoC people, etc. Posted on 2020-05-30 By 老年
5-30 #SavingGrace: MediaTek may become the largest supplier of chips for Huawei’s smartphones in 2H20; Samsung is reportedly ready to start manufacturing 5nm Exynos chips in Aug 2020; etc. Posted on 2020-05-30 By 老年
5-27 #Acknowledge: Samsung has announced Exynos 880; ARM has unveiled two new GPUs; OPPO is allegedly to create an experienced chip team in Shanghai; etc. Posted on 2020-05-27 By 老年
5-25 #HariRaya: Huawei is actively looking for Kirin’s alternative; TSMC is allegedly planning to shift its production focus towards Huawei HiSilicon chips; Huawei may be the first manufacturer to launch the first under panel camera technology; etc. Posted on 2020-05-25 By 老年
5-23 #WeeklyUpdates: Another week, another short recap, please go ahead and download Posted on 2020-05-23 By 老年
5-23 #Noises: Samsung has announced that it will start building a new 5nm chip production line in Pyeongtaek; Huawei is reportedly in talks with MediaTek and UNISOC; Tianma and Visonox have further to expanded capacities for flexible AMOLED; etc. Posted on 2020-05-23 By 老年
