老年 – Page 3 – IF / News

Uncategorised

10-19 #NeverForget : Nvidia is collaborating with Hon Hai to accelerate the AI industrial revolution; Xiaomi has announced HyperOS; Apple is reportedly working with suppliers to develop a foldable iPad; etc.

Qualcomm has announced that they are building on their long-standing collaboration with Google by bringing a RISC-V based wearables solution for use with Wear OS by Google. Qualcomm refers to its chips as platforms and sums up the benefit of… Read more ›

10-13 #StayBlank : MediaTek has collaborated with OPPO and ColorOS; Huawei is reportedly to increase the shipment of its smartphone sales in 2024; vivo and Transsion are allegedly to unveil rollable phone by end of 2024; etc.

Qualcomm has announced its new Snapdragon X Series platform for PC. Snapdragon X Series features Qualcomm’s in-house built Oryon CPU, created by the Nuvia team of ex-Apple engineers that Qualcomm acquired in early 2021 for USD1.4B. The Snapdragon X series… Read more ›

10-9 #BeGrateful : Samsung is reportedly developing a slim foldable laptop with a unique waterdrop hinge; Samsung ring to be delayed till 3Q24 or 1Q25; VinFast Auto is planning to set up assembly units in India and Indonesia; etc.

According to IDC VP Francisco Jeronimo, Google Pixel has shipped 37.9M phones in 2016-2023 – the entire lifecycle of the Pixel lineup thus far. Jeronimo notes that sales are growing in “double digits” in recent years. While that is not… Read more ›

10-7 #CestLaVie : Intel will begin mass production of 1.8nm chips in 2025; Samsung is reportedly developing two near-1″ high-res CIS; Samsung is reportedy to increase prices of NAND products over 10% during 4Q23; etc.

The Semiconductor Industry Association (SIA) has announced global semiconductor industry sales totaled USD44.0B during the month of Aug 2023, an increase of 1.9% compared to the July 2023 total of USD43.2B but 6.8% less than the Aug 2022 total of… Read more ›

10-6 #Holiday2Short : TSMC’s 2nm chips might be delayed until 2026; SMIC has reportedly placed big orders for the raw materials of HiSilicon Kirin 9000S chip; Google Pixel 8 series will be supported with 7 years of “OS, security, and Feature Drop updates”; etc.

TSMC’s highly anticipated 2nm chips might be delayed until 2026, despite initial promises of a 2025 launch. The move to 2nm is crucial for TSMC as it plans to transition from FinFET transistors to Gate-all-around (GAA) technology, aiming for lower… Read more ›

9-24 #BadCold : Apple’s 5G modem prototype is reportedly “3 years behind Qualcomm”; Nio has unveiled its first smartphone in China; Li Auto clarified that the company has no plans to launch a smartphone; etc.

The U.S. Department of Defense (DoD) has entered into a 10-year agreement with GlobalFoundries (GF) to procure U.S. chips for vital defense and aerospace applications. The initial commitment is valued at USD17.3M, with the potential to reach USD3.1B over the… Read more ›

9-20 #Fatigue : Huawei is rumored developing a tri-fold display phone; Samsung is hinting at 200Mp telephoto cameras coming to phones; Tesla has announced that it has produced its 5M-th electric car; etc.

TSMC is said to be cautious about the outlook for customer demand and has notified major suppliers, including Dutch chip production equipment giant ASML, to postpone the delivery of high-end chip manufacturing equipment to TSMC, but the delay is expected… Read more ›

9-14 #Headache : TSMC’s chips that will be manufactured in the Arizona fab will have to be sent to Taiwan for packaging; Qualcomm has entered into an agreement with Apple to supply Snapdragon 5G Modem for next 3 years; OPPO may announce a free 4-year battery replacement initiative; etc.

Encouraged by the American government, Taiwan Semiconductor Manufacturing Co (TSMC), is making its first factory in the US. Apple plans to buy chips from the Arizona factory. The plant will kick off production of chips by 2024. But things have… Read more ›

9-10 #PoorWeekend : Intel plans on taking the help of TSMC in the future; Samsung will allegedly equip its future mid-range chips with AMD GPU; China is reportedly set to launch a new state-backed investment fund that aims to raise about USD40B for its semiconductor sector; etc.

Intel plans on taking the help of TSMC in the future, as its foundry division becomes a victim of delays and process inefficiencies. Goldman Sachs Securities has noted that Intel has been consistently grappling with process upgrade delays since the… Read more ›

8-31 #Merdeka : Apple will receive all of TSMC’s first-generation 3nm process chips in 2023; Google is reportedly partnering with Garmin to bring emergency SOS via satellite to Android phones; Samsung is expected to reveal SimplyChat; etc.

Apple will receive all of TSMC’s first-generation 3nm process chips in 2023 for upcoming iPhones, Macs, and iPads, according to Digitimes. As early as May 2023, Apple was known to have booked nearly 90% of the Taiwanese pure-play foundry for… Read more ›

8-26 #Headache : Huawei has been accused of building a a series of secret chip-making facilities across China; Samsung will allegedly launch a phone with a rollable OLED display sometime in 2025; Intel’s expanding fab site in Oregon will serve as a foundry for MediaTek; etc.

Huawei has been accused of building a a series of secret chip-making facilities across China, under the names of other companies, to help the technology company bypass US sanctions. Huawei reportedly moved into chip production in 2022 and was receiving… Read more ›

8-24 #Congrates : MediaTek has announced it is working closely with Meta’s Llama 2; Samsung aims to proceed with an annual Galaxy S FE launch; Honor will soon launch its new smartphones in India under the brand HonorTech; etc.

Global governments are securing graphics processing units (GPUs) for AI development, with countries like UK and Saudi Arabia investing heavily. Saudi Arabia and UAE have purchased thousands of Nvidia’s H100 chips for AI research and innovation, despite the high cost… Read more ›

8-20 #WhyBother : Samsung Display has showcased a bezel-less smartphone display; Samsung is reportedly working on 4 very different camera sensors; Samsung has indicated that its investment in foldable devices is only going to grow; etc.

Samsung Electronics’ Taylor, Texas chip factory will manufacture U.S.-based AI chip designer Groq’s next-generation processor using its 4nm manufacturing technology. The Taylor chip factory is Samsung’s USD17B chip manufacturing project, slated to finish construction within 2023 and start mass production… Read more ›

8-17 #Snowflakes :Qualcomm is allegedly going to lower cost focusing on low-end 5G chips; Honor is reportedly working on multiple foldable phones; Honor has teased a return to the Indian smartphone market; etc.

As the recovery of the mobile phone market is not as good as expected, it is believed that to speed up the clearance of inventory, Qualcomm is going to lower cost, mainly focusing on low-end 5G mobile phone chips, with… Read more ›

8-13 #LegoFun : Arm allegedly plans to float its shares in an IPO on the Nasdaq in Sept; Google will soon require specific hardware quality standards for foldable phones; OnePlus new smartphone to feature new self-developed “Rainwater Touch Control”; etc.

SoftBank Group’s British chip design unit, Arm, allegedly plans to float its shares in an initial public offering on the Nasdaq in Sept 2023. The unit’s market capitalization by that time is expected to be more than USD60B, which would… Read more ›

8-5 #PhD : Qualcomm invests in a new company developing RISC-V products; Nothing has announced a new brand, CMF by Nothing; India has restricted import of certain laptops and computers under HSN 8471 with immediate effect; etc.

Intel has allocated USD425M, or approximately 34%, of its inaugural USD1.25B green bond proceeds. As highlighted in its first green bond impact report, the proceeds, which support Intel’s investments in sustainable operations, have been allocated across five project categories: pollution… Read more ›