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1-5 #SoWhat : ASML’s export license for the shipment of some chip-making equipment to China has been partially revoked; Huawei has reportedly issued a “purchasing order” for the foldable phone supply chain; Huawei allegedly will not launch a 5G phone below CNY3,000 in 2024; etc.

Dutch semiconductor equipment company ASML said that an export license for the shipment of some chip-making equipment to China has been partially revoked by the Dutch government. A license for the shipment of NXT: 2050i and NXT: 2100i lithography systems… Read more ›

12-31 #Happy2024 : ADI has recently issued a price increase notice to its Chinese distributors; Royole Technology has defaulted on its employee wages for a year; Samsung and SK hynix are making strides in commercializing “On-sensor AI” technology for image sensors; etc.

Analog Devices Inc (ADI), a major analog IC manufacturer, has recently issued a price increase notice to its Chinese distributors. The notice indicates an estimated price increase of 10-20%, set to take effect in Feb 2024. ADI stated in the… Read more ›

12-28 #Calling : Huawei’s first overseas factory will be completed in France; ASML has shipped first High-NA EUV to Intel; Xiaomi’s first EV SU7 is unveiled; etc.

The Deputy General Manager of Huawei France, Minggang Zhang, has revealed Huawei’s first overseas factory will be completed in the northeastern Alsace region of France, in Brumath in Bas-Rhin. Huawei is investing EUR200M in the project. Instead of smartphones, this… Read more ›

12-21 #Freezing : Huawei’s new nova will allegedly feature a new Kirin 5G chipset; Samsung has unveiled two new ISOCELL Vizion sensors; LG will unveil its transparent antenna for automobiles; etc.

Huawei has released a new 5nm chip, the Kirin 9006C SoC. Earlier 2023, Huawei achieved a breakthrough with their 7nm ARM processor, the Kirin 9000S. The processor was manufactured by Semiconductor Manufacturing International Corporation (SMIC) and powers the Huawei Mate… Read more ›

12-17 #Meaningless : Samsung and ASML have committed to jointly invest KRW1T; Samsung allegedly has its foldable capacity strengthened for Apple; Samsung is allegedly considering a smaller phone than the Galaxy S Ultra; etc.

TrendForce’s research indicates a dynamic third quarter for the global foundry industry, marked by an uptick in urgent orders for smartphone and notebook components. This surge was fueled by healthy inventory levels and the release of new iPhone and Android… Read more ›

12-9 #Turbulance : Huawei is allegedly testing two image sensors; LG Innotek has begun development of under panel camera; Tecno has showcased 3 innovative camera technologies; etc.

Chinese artificial intelligence (AI) chip company Shanghai Biren Intelligent Technology has recently received a commitment of CNY2B (about USD280M) from investors backed by the Guangzhou government. The support comes after the company faced blacklisting by the U.S. government. The US… Read more ›

12-6 #Recap : SMIC is reportedly pushing forward with its 5nm technology; Apple’s work on implementing 6G cellular connectivity on its devices appears to be ramping up; IBM and Meta launched the new AI Alliance; etc.

Samsung reportedly purchased chips worth USD6.943B in the first 3 quarters of 2023. The total spending in 2019 was just USD2.3B, so the amount has almost quadrupled over the past 4 years. It spent USD4.3B in 2020, USD4.8B in 2021,… Read more ›

12-5 #Humanity : Samsung Galaxy S25 and S25 Plus will allegedly drop ISOCELL; Samsung is reportedly readying a proper 200Mp 1” ISOCELL camera for smartphones; Apple is reportedly planning to include the Action button on the entire iPhone 16 range; etc.

Siemens AG has announced that it signed a Memorandum of Understanding (MoU) with Intel on cooperation in the field of digitalization and sustainability in microelectronics manufacturing. The companies will focus on developing future manufacturing, improving factory operations and cybersecurity, and… Read more ›

11-30 #TooOld : Samsung is allegedly rebranding its Exynos to “Dream Chip”; Samsung reportedly will increase prices of its CIS in early 2024; Nvidia CEO Jensen Huang has said that AI will be “fairly competitive” with humans in 5 years; etc.

Chinese chip company Loongson Technology has unveiled its latest self-developed central processing unit (CPU) 3A6000, which can be used in multiple applications across different platforms. It has 4 physical cores / 8 logic cores, main frequency 2.0-2.5GHz. Loongson 3A6000 adopts… Read more ›

11-25 #Drive : Honor is preparing for an IPO; Baidu has reportedly ordered AI chips from Huawei; Nvidia is reportedly delaying the launch of a new AI chip; etc.

MediaTek has announced Dimensity 8300, which is fabed on TSMC’s second-generation 4nm process. Dimensity 8300 features 4x Arm Cortex-A715 performance cores clocked at up to 3.35GHz alongside 4x Arm Cortex-A510 efficiency units at up to 2.2GHz clock speeds. All eight… Read more ›

11-21 #SoWhat : MediaTek has announced a new partnership with Meta; Samsung claims no plan to produce mid-range foldable; Samsung has reportedly excluded BOE from its supply chain; etc.

Apple has fallen further behind in its multibillion-dollar effort to make a modem chip for the iPhone, stymied by the complexity of replacing an intricate Qualcomm component. After already delaying a plan to have an in-house chip ready by 2024,… Read more ›

11-12 #BadEyes : Samsung is reportedly working on mid-range Galaxy foldables for 2024; OPPO and Hasselblad announced next-gen HyperTone Camera System; Samsung is to expand NAND production cuts by 40-50% by 1H24; etc.

In response to the global shortage of GPUs, Fujitsu has developed “Adaptive GPU Allocator Technology”, a technology that can automatically switch between CPU and GPU computing resources in real time even during program processing. This technology can allocate GPUs in… Read more ›

11-7 #NoWar : Samsung Display sues BOE; Changxin Xinqiao Memory Technologies has raised CNY39B; Samsung will allegedly be using a frame case made out of titanium in its upcoming Galaxy S24; etc.

Apple’s A17 processor was the first chip to use TSMC’s N3 (3nm-class) process technology, the company has expanded its N3 lineup with a family of PC-oriented M3 chips for desktop and laptop computers. Analyst Jay Goldberg from Digits to Dollars… Read more ›

11-3 #TidyUp : Samsung has worked with AMD and Qualcomm to jointly develop FSR; YMTC has developed and mass-produced 232-layer 3D NAND flash; Samsung plans to unveil a smartphone with integrated generative artificial intelligence (AI) technology in 2024; etc.

Samsung Electronics has allegedly received an order for Google’s upcoming Tensor G4 SoC, which will make its way to the Pixel 9 series. The Tensor G4 will feature an improved CPU from the G3. It bears an internal project codename… Read more ›

10-26 #Whatsthepoint : Nvidia and AMD are reportedly planning to launch Arm-based CPUs; Samsung is allegedly planning to apply gOLED to the low-cost smartphone; Motorola has introduced a concept device equipped adaptive display technology; etc.

Qualcomm has announced the Snapdragon 8 Gen 3 flagship platform. It all starts with the AI Engine, which supports multi-modal generative AI models and popular large language models for speech recognition – the chip can run up to 20 tokens… Read more ›

10-21 #Hiking : Nio’s first self-developed chip will go into mass production in Oct 2023; Intel has announced a new initiative, the AI PC Acceleration Program; Nokia is to cut 9,000-14,000 jobs by the end of 2026 to cut costs; etc.

Huawei allegedly to launch Kirin 830, which will be adopted by its nova 12 series to be expected by end of 2023. The performance of the Kirin 830 is rumored to be on par with Snapdragon 778G or Snapdragon 870… Read more ›