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Daily News / Weekly Summary / Regular Discussion

1-27 Pray for Hubei: Intel has joined the CHIPS Alliance; Broadcom has announced that it has signed two new agreements with Apple; etc
1-22: JDI has developed the world’s first ultrathin image sensor that measures fingerprints, veins and pulse waves; Xiaomi’s plan for 2020 includes a big emphasis on Western Europe due to them gaining plenty of traction there; etc.
1-21: Samsung Electronics is investing USD500M in its India operations to set up a manufacturing plant; BOE Gen-6 flexible display factory at Chengdu output will increase by 2-3 times in 2020; etc.