Read more.. 11-13: Intel has announced the Intel XMM 8160 5G modem; Xiaomi, Lenovo, Meizu, Alibaba’s Tianmao, JD.com Singles’ Day results; etc.
Read more.. 11-11: Samsung Electronics will produce over 1M units in initial stock for its upcoming foldable phone; Samsung is allegedly developing a new Galaxy M line-up of phones; etc.
Read more.. 11-10: Samsung has shown off its Infinity Flex foldable phone; Samsung’s new “infinity display” pushes 3 other fresh designs; etc.
Read more.. 11-06: SK Hynix will start the early stage of mass production of the “4D NAND” later in 2018; Samsung Galaxy S10 reportedly would adopt Qualcomm’s third-gen ultrasonic fingerprint sensors; etc.
Read more.. 11-03: MediaTek Helio M70 5G baseband chip will hit the market in 1H19; Samsung Electronics has slashed 2018 capex by more than a quarter; etc.
Read more.. 11-01: Samsung has filed a trademark of “Infinity-V”; LG Electronics allegedly intends to introduce its first foldable smartphone early 2019 at CES; etc.
Read more.. 10-30: Panasonic has announced the development of the world’s first 8K organic sensor and 8K camera system; Micron Technology has announced the opening of a new plant in Taichung; etc.
Read more.. 10-27: Qualcomm has said that Apple is USD7B behind in patent royalty payments to the mobile chip firm; Samsung and Google have reportedly been working on developing a special version of the Android operating software for the foldable phone; etc.
Read more.. 10-25: Google allegedly requires Android device makers to regularly install updates for any popular phone or tablet for at least 2 years; Facebook confirms that the company is building AR glasses; etc.
Read more.. 10-24: Samsung has revealed that the next wave of UFS products will launch in 1H19; Samsung and SK Hynix have already kicked off their respective DRAM EUV technology R&D; etc.
Read more.. 10-23: Qualcomm a series of announcements; Samsung and Qualcomm have announced a new partnership in 5G small cell development; etc.
