Read more.. 02-15: TSMC will soon kick off commercial production for Qualcomm Snapdragon 855 processor; vivo is allegedly testing 44W fast charging technology; etc.
Read more.. 02-14 Happy Valentine’s Day: JDI will reportedly receive up to JPY80B in a bailout from a group of Chinese and Taiwanese investors; Google plans to unveil its first lower-priced smartphone in 2019 as part of an aggressive push into hardware; etc.
Read more.. 02-12: OPPO has announced its partnership with ITE&C in India; vivo officially announces ‘iQOO’ as its sub-brand; etc.
Read more.. 02-10: Thailand has launched a Huawei 5G test bed; Apple’s French division said it has reached a deal with France to pay an undeclared amount of back-dated tax; etc.
Read more.. 02-08 Happy CNY: Qualcomm is launching the Snapdragon 712 platform; Xiaomi CEO Lei Jun reveals that In 2019, Xiaomi launches a multi-brand strategy; etc.
Read more.. 02-03: China Mobile and Huawei have jointly announced that they have successfully made the first call of 5G; Samsung Galaxy A90 is reportedly to feature a pop-up selfie camera; etc.
Read more.. 02-02: Honor’s 5G smartphone would arrive in 2H19; OPPO has announced its continue of European expansion in United Kingdom, Poland and Turkey; etc.
Read more.. 01-31: SMIC is expected to enter volume production of chips built using 14nm FinFET process technology in 1H19; Foxconn is reconsidering plans to make advanced LCD panels at a USD10B Wisconsin campus; etc.
Read more.. 01-30: Samsung has announced an 8K display driver IC (DDI); Samsung has begun mass producing the industry’s first 1TB UFS 2.1; etc.
Read more.. 01-29: TSMC has announced that for the second time in less than 6 months, a problem has caused issues with its chip production; Samsung has announced that the company will start taking steps in 2019 to replace plastic packaging materials with paper and other environmentally sustainable elements; etc.