Read more.. 05-24: TSMC has indicated that its shipments to Huawei Technologies are not affected; Huawei allegedly has been removed from the list of consortium members of SD card; etc.
Read more.. 05-23: LGD has started pilot production of its 8.5th generation OLED production line in Guangzhou; EE’s 5G network will launch in the UK 30 May 2019; etc.
Read more.. 05-22: SEMCO has begun mass-producing a 5× optical zoom camera module; Sony mobile will pull out of several markets in order to focus on a smaller client base; etc.
Read more.. 05-21: Infineon is denying a report that it has suspended deliveries to Huawei; U.S. Commerce Department has given Huawei a temporary license to maintain its current products; etc.
Read more.. 05-20: TSMC will not stop its supply plan for Huawei; Google reassure owners that existing devices with “services like Google Play & security from Google Play Protect will keep functioning on your existing Huawei device”; etc.
Read more.. 05-18: Samsung has officially released its new mid-range smartphone chip, Exynos 9609; Huawei Technologies is allegedly asking its top Asian chipmakers to maintain deliveries; etc.
Read more.. 05-17: ARM is unveiling its design for the Arm Mali-D77 display processor; Corning is introducing a new glass substrate, Corning Astra Glass; etc.
Read more.. 05-15: Samsung’s roadmap includes 4 FinFET-based processes from 7nm down to 4nm that leverage EUV technology as well as 3nm GAA; OPPO will allegedly announce a smartphone with under display camera this year; etc.
Read more.. 05-14: HMD Global has entered into a direct worldwide license arrangement with Qualcomm; AUO has unveiled its 6” FHD+ 2304×1080 LTPS LCD screen with optical in-cell fingerprint; etc.
Read more.. 05-12: AU Optronics (AUO) will continue to strive into the high-end segments of a display market; Honor 20 series will have a Dynamic Holographic glass back made with the new Triple 3D Mesh process; etc.
Read more.. 05-11: TSMC is on track to move 5nm process technology to volume production in 2020; Samsung has introduced two new 0.8μm pixel image sensors; etc.
Read more.. 05-08: Google I/O 2019 – a series of announcements; Intel has revealed plans for Project Athena Open Labs in Taipei, Shanghai and Folsom, California; etc.
Read more.. 05-07: Qualcomm is expected to launch the 5G-enabled Snapdragon 865 chipset (codenamed Snapdragon 8250) in 2 variants; Samsung and LG are reportedly either shutting down their production lines in South Korea or are curtailing domestic output; etc.