Read more.. 01-18: BOE Technology has begun construction of its third 6G flexible OLED panel line in Chongqing; The upcoming OPPO R and the next vivo X phone will reportedly equipped with pop-up camera; etc.
Read more.. 01-16: OPPO has introduced 10x hybrid optical zoom camera technology; Xiaomi has announced a new fingerprint sensor technology that fixes 2 major issues related to the in-display fingerprint sensor; etc.
Read more.. 01-15: Unimos has recently kicked off volume production at its 3D NAND memory chips packaging and testing lines; OPPO has announced that it has officially established an Emerging Mobile Terminal Division; etc.
Read more.. 01-13 CES 2019: Continue to follow… TCL and Samsung have showcased their first batch of 8K TV products; Sony is reshuffling its mobile division; etc.
Read more.. 01-11 CES 2019: Series of CES news on-going, Royale showcasing a number of applications of flexible display; LG indicates won’t exit smartphone business; etc.
Read more.. 01-08 CES 2019: AMD, Nvidia, Huawei, Qualcomm and Intel have a series of announcements for their own chipsets; Samsung has announced 2 new displays using modular Micro LEDs; etc.
Read more.. 01-05: South Korea to regulate OLED equipment export to China; China will implement a new set of strict regulations on the operations of the PCB industry; etc.
Read more.. 01-03: SK Innovation will showcase a key material for flexible displays; Meizu is allegedly on the way to receive a CNY100M fund injection; etc.
Read more.. 01-01 Happy 2019: A series of numbers consolidated from a number of reports including Goldman Sachs, Morgan Stanley, etc.
Read more.. 12-31 Happy New Year! LGD’s P10 plant construction has been postponed with no definite plan; Small- to medium-size flat panel makers in Taiwan and Japan engulfed in difficulties are desperately seeking ways to bail themselves out; etc.
Read more.. 12-28 New Year is coming soon! Foxconn is in the final stages of talks with the Zhuhai municipal government to build a chip plant there; plans to start production of its 3D chips 2019 summer; etc.
Read more.. 12-25 Happy Holidays: OPPO is exploring 10 times lossless zoom technology for its camera; Meizu reportedly has begun its own foldable display project; etc.
Read more.. 12-21: TSMC has announced it will begin 5nm risk production in 2Q19; IBM has announced an agreement with Samsung to manufacture 7nm microprocessors; etc.