Read more.. 08-14: Samsung has revealed that it wishes to become the first in the world to release an operational foldable smartphone; Samsung is reportedly considering to shutdown one of its two smartphone manufacturing units in China; etc.
Read more.. 08-11: Qualcomm has reached a settlement with Taiwan’s antitrust regulators that reverses most of a USD773M fine; BOE Technology is making preparations for trial production of micro-OLED panels for AR/VR applications; etc.
Read more.. 08-09: Qualcomm announcing Snapdragon 670; Xiaomi officially announcing POCO sub-brand; etc.
Read more.. 08-08: Holitech Technology would invest about USD200M in 3 years in India; Huawei reportedly will monopolize Qualcomm’s 2nd-gen ultrasonic fingerprint technology for several months; etc.
Read more.. 08-07: TSMC is close to returning its production lines back to normal; Google Android P Pie is official; etc.
Read more.. 08-05: TSMC has shut down several of its factories last night after it its systems were hit by a computer virus; ) is allegedly collaborating with “a global OEM” to produce a foldable panel for one of its traditional partners; etc.
Read more.. 08-03: Tesla is creating its own chips optimized for machine learning; Starbucks has officially struck a partnership with Alibaba Group; etc.
Read more.. 08-02: Sharp is going to sell smartphone using its own OLED panel; Unigroup Guoxin expects to push DDR4 to the market by end of 2018; etc.
Read more.. 07-31: Xiaomi and OPPO are aiming to launch their own versions as early as 2019; Samsung is reportedly planning to give its next Galaxy A series device a triple-camera and an in-display fingerprint sensor; etc.
Read more.. 07-29: IC foundries have seen their 8” fabs run at full utilization; The recent ramp capacity of Chinese vendors could lead to oversupply for the memory in 2019; etc.
Read more.. 07-27: Apple likely will not use its cellular modems in the next iPhone; Huawei is planning to roll out the first foldable handset with a flexible screen ahead of its bigger rival Samsung; etc.
Read more.. 07-25: Qualcomm is announcing the final version of their mmWave antenna module; Sony has announced the upcoming release of the IMX586; etc.
Read more.. 07-23: BOE Technology is seeking to supply Apple with OLED displays for future iPhone models; TRAI has proposed to “derecognise” devices that bar installation of TRAI’s DND app; etc.
