Read more.. 12-12: Taiwan notebook ODMs see low order visibility for 1H19 because of Intel’s shortage of SoCs; Huawei is planning a new 20W SCP charge protocol; etc.
Read more.. 12-11: Qualcomm has won a preliminary order in a Chinese court banning the import and sale of some Apple iPhone models; Xiaomi Mijia is officially landed in Mexico; etc.
Read more.. 12-08: Qualcomm has unveiled its latest product Snapdragon 8cx for the laptop market; Samsung will allegedly incorporate 3D sensors into its mid-range Galaxy A handsets; etc.
Read more.. 12-05: Qualcomm’s series of announcements; AT&T and Verizon will launch Samsung 5G phone in 1H19; etc.
Read more.. 12-02: A federal judge has set a trial date for Qualcomm’s lawsuit against Apple; There will be consolidation of reports once a month in the future (an effort); etc.
Read more.. 12-01: OPPO has successfully conducted the world’s first WeChat video call using a 5G smartphone; vivo plans to invest over INR4,000 crore on its second ‘Make in India’ phase; etc.
Read more.. 11-29: The first OPPO foldable smartphone will be revealed at MWC in Feb 2019; GIS and O-film are likely to share the orders for ultrasonic in-display fingerprint sensors from Samsung; etc.
Read more.. 11-28: Sony allegedly will soon announce these 2 new Full Frame sensors; Sprint and HTC are working together to bring a powerful 5G mobile smart hub to U.S. customers in 1H19; etc.
Read more.. 11-27: BOE has announced the company has successfully developed China’s first 55” 4K ultra-high-definition OLED display using inkjet printing technology; Samsung Display is already producing the Infinity-O displays for Galaxy S10 launch in 2019; etc.
Read more.. 11-26: Samsung Galaxy A8s reportedly will feature Infinity-O panel, which is an LCD panel produced by BOE; Huawei is reportedly aiming to launch a smartphone featuring a cut-out camera hole display before A8s; etc.
Read more.. 11-24: ZTE has announced the company’s first 5G network deal with JT Global in Channel Islands; OPPO R&D investment would amount to CNY4B in 2019; etc.
Read more.. 11-22: TSMC expects to complete over 100 tape-outs for 7nm and 7nm EUV processes in 2019; LGD is allegedly working closely on a joint project to deliver folding panels to Huawei, Xiaomi and Lenovo; etc.
Read more.. 11-20: Huawei has allegedly shown the foldable 5G phone to high ranking officials at carriers in Korea; Meitu has announced that Xiaomi is effectively taking over its hardware business; etc.