Read more.. 11-20: Samsung reportedly plans to ship some 60M Galaxy M and A series phones made in China by ODM; Samsung is allegedly using a 108MP primary camera sensor on the Galaxy S11; etc.
Read more.. 11-17: The 100” 8K LCD screen developed by Chengdu CEC Panda will be mass-produced by the end of 2019; BOM cost of Samsung Galaxy Fold 5G (sub-6GHz) is USD635; etc.
Read more.. 11-16: Xiaomi has revealed that all the phones it will release in 2020 priced above CNY2000 will have 5G support; China Mobile will release 47 5G terminals of 5 categories together with 34 partners; etc.
Read more.. 11-13: Samsung Display has reportedly inked an exclusivity deal with Dowoo Insis for Ultra-Thin Glass (UTG); LG Electronics has filed lawsuits against TCL in the German district courts of Mannheim and Düsseldorf; etc.
Read more.. 11-10: Defects have been found in Samsung’s foundry products; MediaTek is launching its first 5G SoC chip, codenamed MT6885Z; etc.
Read more.. 11-07: Nokia and China’s three major operators have signed a cooperation framework agreement of 2020; Xiaomi has confirmed that Xiaomi plans to enter Japan by 2020; etc.
Read more.. 11-05: Samsung is reportedly currently working on a layoff plan in China; OPPO has announced establishment of a 5G joint lab with Ericsson; etc.
Read more.. 11-03: Google has announced that it will acquire US-based fitness company Fitbit; Samsung’s custom CPU core arm of the company is reportedly shutting down; etc.
Read more.. 11-01: Xiaomi has officially opened its camera technology R&D hub in Tampere, Finland; Sony plans to invest USD918M in its new image sensor factory in Nagasaki; etc.
Read more.. 10-30: About 60M units or 20% of Samsung’s handset shipments in 2020 will be manufactured by China-based ODMs; Xiaomi and Ericsson have signed a global patent license agreement at the Delhi High Court in India; etc.
Read more.. 10-29: Huawei has reportedly developed a Power Amplifier (PA) chip; TSMC and Globalfoundries (GF) have announced they are dismissing all litigation between them; etc.
Read more.. 10-27: TSMC has raised its capital expenditure for 2019, reaching USD14B-15B; Micron has its first 3D Xpoint product X100 SSD; etc.